ATS-09A-200-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.969" (50.00mm)
Width:	1.969" (50.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.76°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal Heat-Sink Technology

Thermal heat-sinks are a type of technology used for cooling electronic devices. By transferring heat away from the components, they provide a more efficient means of cooling than traditional air-cooled systems. The technology itself has been in use since the early days of computers, but there have been significant improvements and developments over the past decade.The ATS-09A-200-C1-R0 is a specific type of thermal heat-sink that is designed to provide low-cost cooling solutions for high-density applications. In this article, we will look at the ATS-09A-200-C1-R0’s application fields and working principles.

Application Fields of ATS-09A-200-C1-R0 Thermal Heat-Sink

The ATS-09A-200-C1-R0 thermal heat-sink is designed for use in high-density computing applications, where cooling is required in a small form-factor. Due to its size and low cost, this type of heat-sink is ideal for embedded system solutions.In particular, the ATS-09A-200-C1-R0 is suitable for applications such as digital signal processing (DSPs), graphics processing units (GPUs), high-end mobile phones, tablets, servers and industrial computers. It can also be used in other specialty electronics and industrial computing applications such as avionics, military and medical electronics.

Working Principles of ATS-09A-200-C1-R0 Thermal Heat-Sink

The ATS-09A-200-C1-R0 is a types of heat-sink that takes advantage of a number of different principles in order to maximize its cooling performance.The device utilizes a combination of convection and the conduction Enhancement (CE) technology that is designed to optimize air flow around the heat-generating elements. The Coolant Manifold (CM) design works by channeling the cool air away from the electronics components in order to maximize heat transfer.The ATS-09A-200-C1-R0 also utilizes a standard pin-fin heat-sink design. This design works by allowing air to flow freely around the fins, thus increasing the surface area that can dissipate heat away from the integrated components.The combination of these technologies allows the ATS-09A-200-C1-R0 to provide superior cooling performance in high-density applications where space is limited.

Conclusion

With the need for improved cooling solutions in increasingly high-density computing systems, thermal heat-sinks have become an increasingly popular and cost effective option. The ATS-09A-200-C1-R0 is a specific type of thermal heat-sink that provides a reliable cooling solution for applications such as digital signal processing, graphics processing, mobile phones, tablets, servers and industrial computing.The device utilizes a combination of convection and conduction Enhancement (CE) technology, along with a Coolant Manifold (CM) and pin-fin design. This enables the ATS-09A-200-C1-R0 to provide superior cooling performance in a small form factor – making it an ideal choice for embedded system solutions and high-density applications.

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