ATS-09A-205-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-09A-205-C1-R0-ND

Manufacturer Part#:

ATS-09A-205-C1-R0

Price: $ 3.68
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X6MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09A-205-C1-R0 datasheetATS-09A-205-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.34026
30 +: $ 3.25017
50 +: $ 3.06974
100 +: $ 2.88912
250 +: $ 2.70857
500 +: $ 2.61828
1000 +: $ 2.34741
Stock 1000Can Ship Immediately
$ 3.68
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.236" (6.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 12.98°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Hydraulic heat sinks are used in a variety of applications, including mechanical cooling, medical research, and environmental monitoring. The ATS-09A-205-C1-R0 is a thermal-heat sink designed to remove heat from computer components and other types of electronic systems to help maintain operating temperatures. It makes use of a hydraulic cooling process and is able to maintain levels far below those achievable through the use of traditional mechanical cooling methods.

The ATS-09A-205-C1-R0 consists of two components, an absorption surface and a thermal transfer surface. The absorption surface absorbs the heat produced by the electronics and transfers it to the thermal transfer surface. This surface is then cooled by the hydraulic process. The process involves pumping a liquid (such as oil or water) through the thermal transfer surface to carry the heat away from the electronics.

The ATS-09A-205-C1-R0 is designed to be connected to the electronics via a number of heat-dissipating vents, which are strategically placed to allow maximum heat transfer. These vents are designed to be open, allowing for optimal airflow and therefore increasing the efficiency of the cooling process. This type of heat-sink is usually mounted directly to the electronics it is intended to cool.

When in use, the ATS-09A-205-C1-R0 creates a circulating system in which the liquid is moved from the absorption surface to the thermal transfer surface, where it is cooled before being returned to the absorption surface. This continuous process ensures that the heat produced by the electronics is kept at an acceptable level. As well as cooling the electronics, the ATS-09A-205-C1-R0 is also capable of improving the reliability and performance of the electronics by preventing overheating.

As well as being used to cool electronics, the ATS-09A-205-C1-R0 has a range of other applications including medical research. This type of heat-sink is often used in experiments involving the measurement of temperature-sensitive proteins, as it is able to keep the proteins in stable temperatures for long periods of time. It is also ideal for use in environmental monitoring, as it is able to measure and control the temperature of a variety of natural processes. By attaching the ATS-09A-205-C1-R0 to the environment, scientists can better understand how external factors such as temperature affect the environment.

Overall, the ATS-09A-205-C1-R0 is an effective and efficient way of removing and controlling heat from electrical and electronic equipment. It is able to do this without relying solely on mechanical cooling methods, making it an ideal solution for a variety of applications. As well as providing a reliable and efficient way of cooling electronics, the ATS-09A-205-C1-R0 can also be used to improve the performance and reliability of the components it is designed to cool. Furthermore, its use in other applications such as medical research and environmental monitoring makes it a versatile and useful product.

The specific data is subject to PDF, and the above content is for reference

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