ATS-09A-25-C3-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal risk management is an important part of any engineering design process. Heat is a by-product of many electronic components and devices, including TVs, laptops, phones, and tablets. In order to keep them from getting too hot, the use of a suitable thermal management system is necessary. Heat sinks are one of the popular thermal management systems used in many devices. The ATS-09A-25-C3-R0 is a high-performance heat sink which is used in many electronics to help dissipate heat.

The ATS-09A-25-C3-R0 belongs to the family of high performance heat sinks and is made up of special aluminum alloy materials. It features a 0.9mm thick extruded aluminum fin with a fin thickness of 0.098mm. The total height of the device is 25mm, and it has a width of 50mm and a maximum depth of 30mm. These dimensions make it suitable for use in many types of electronic components. It has an open-ended desing, which makes it easy to install and maintain. The device also has a thermal efficiency of above 80%, making it an ideal choice for heat management.

The ATS-09A-25-C3-R0 is mainly used for cooling specific locations within electronic products. This includes high powered microprocessors, motherboards, integrated circuit chips, and other semi-conductor components. The device can also be used to improve air flow circulation throughout an electronic system, as well as to reduce the effect of sound caused by fans. It can also be used in areas of high heat density, which can cause an increase in temperature in an area. In addition, the device can help reduce electromagnetic interference from components as well as reduce thermal energy.

The ATS-09A-25-C3-R0 works by transferring heat from hot components to a cooler external environment. Heat is transferred through four main processes: conduction, convection, radiation, and evaporation. Heat from the components inside the device is conducted by the aluminum alloy, which produces a cooler layer of air around the components. This layer of air is then pushed out by the fans, which creates a convective flow of air. As this airflow increases, the radiant heat from the components is carried away from the device. Finally, the evaporative process helps to cool the airflow as it passes through the device.

The ATS-09A-25-C3-R0 is a highly efficient thermal management system designed to increase performance and reduce heat in electronic components. The device features a 0.9mm thick aluminum alloy fin with a thickness of 0.098mm. It has a total height of 25mm and a maximum depth of 30mm, making it suitable for many types of components. Its open-ended design makes it easy to install and maintain, while its thermal efficiency of over 80% make it an ideal choice for heat management. It works by transferring heat from inside the components to external cooler environments, and is capable of decreasing component temperature by as much as 5-12°C. Overall, the ATS-09A-25-C3-R0 is the perfect solution for thermal management in heat sensitive components.

The specific data is subject to PDF, and the above content is for reference