| Allicdata Part #: | ATS15459-ND |
| Manufacturer Part#: |
ATS-09A-48-C2-R0 |
| Price: | $ 3.95 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X35MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09A-48-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.59100 |
| 10 +: | $ 3.49335 |
| 25 +: | $ 3.29918 |
| 50 +: | $ 3.10502 |
| 100 +: | $ 2.91098 |
| 250 +: | $ 2.71691 |
| 500 +: | $ 2.52285 |
| 1000 +: | $ 2.47433 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important constituent of modern electronics and electrical engineering. It helps in cooling and dissipating heat from a system which, if not controlled, can damage or ruin the components within the system. Heat sinks, being such an important part of thermal management, need to be carefully designed and installed to ensure a smooth functioning of the electronic devices. The ATS-09A-48-C2-R0 is one such heat sink designed to dissipate heat effectively from an electronic device.
Introduction to ATS-09A-48-C2-R0
The ATS-09A-48-C2-R0 is a reliable and high performance heat sink designed to dissipate heat efficiently from complex electronic devices. This heat sink has been designed using high quality thermal conductive materials such as copper, aluminum, and stainless steel. It is an economical, yet reliable solution for dissipating heat from electronic devices with limited space. It is perfect for a wide range of applications, such as consumer electronics, communications, automotive, medical devices, and industrial PCBs.
Application Field and Working Principle
The ATS-09A-48-C2-R0 is suitable for both cooling and dissipating heat. It is able to dissipate heat from components without affecting the surrounding environment. It works on the principle of forced-air convection, which forces air through its fins to better extract the heat away from the heat source. The fin pattern on the ATS-09A-48-C2-R0 design ensures an even distribution of heat, resulting in a higher cooling efficiency. The optimized design allows this heat sink to be easily installed in a wide range of applications, from consumer electronics to industrial applications.
Performance Advantages
The ATS-09A-48-C2-R0 offers a number of performance advantages for its use in cooling and dissipating heat. It has an efficient design that allows for immediate heat dissipation without a warm-up period. It also offers an efficient thermal insulation that helps maintain a consistent temperature even under high heat conditions. The heat sink also offers superior heat resistance that helps prevent component damage from the heat generated by the electronic device.
Additionally, the ATS-09A-48-C2-R0 has a high power dissipation rate, allowing it to quickly dissipate heat. It also has a larger contact area that ensures better heat dissipation than other heat sinks in the same class. The efficient design also helps reduce noise levels by dissipating heat more quietly than other heat sinks.
Installation and Maintenance
The ATS-09A-48-C2-R0 is easy to install and maintain. It is compatible with a wide range of mounting setups, including screw and clamp mounting. Once installed, the heat sink should be inspected regularly to ensure there is no buildup of dust and debris that can impede its functioning. If necessary, the heat sink can be cleaned with a soft cloth and mild soapy water.
Conclusion
The ATS-09A-48-C2-R0 is a reliable and efficient heat sink designed for cooling and dissipating heat. It has an efficient design that allows for immediate heat dissipation without a warm-up period. The optimized design allows this heat sink to be easily installed in a wide range of applications, from consumer electronics to industrial applications. The heat sink also offers superior heat resistance that helps prevent component damage from the heat generated by the electronic device. Finally, it is easy to install and maintain. If necessary, the heat sink can be cleaned with a soft cloth and mild soapy water.
The specific data is subject to PDF, and the above content is for reference