ATS-09A-63-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.42°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction about ATS-09A-63-C3-R0

ATS-09A-63-C3-R0 is a high-performance thermal solution for electronics systems. This product line contains a range of heat sinks, designed for increased thermal efficiency while providing excellent power consumption. The product\'s superior heat transfer capabilities combined with its low noise emission make it an ideal choice for electronic device cooling solutions. ATS-09A-63-C3-R0 has a wide range of applications in various industry sectors, due to its high-performance, cost effective design.

Application Field of ATS-09A-63-C3-R0

ATS-09A-63-C3-R0 thermal solution can be used in many electronic system applications, such as consumer and industrial electronics, computers & servers, HVAC & cooling systems, medical & instrumentation, aerospace and automotive applications. As a thermal solution, ATS-09A-63-C3-R0 reduces the need for traditional cooling solutions, such as fans, which can generate noise and impact the heat transfer capacity of other components, such as processors, graphics cards, and other heating elements.The thermal solution has a smaller profile than traditional heat sinks, which makes it a suitable choice for applications that need to reduce the overall volume or weight of the device. It also has a low thermal resistance and a high performance thermal joint, which allows more efficient heat management. Additionally, its cost is relatively low compared to other high performing thermal solutions.

ATS-09A-63-C3-R0\'s Working Principle

The working principle behind ATS-09A-63-C3-R0 is based on heat sink technology. This thermal solution is used to disperse the generated heat from an electronics device into its surroundings. It performs this task through the use of a passive aluminum block, which creates a panel of aluminum plates that combines with a thermal reflective interface to enable efficient heat transfer to the ambient environment.The aluminum block is designed to dissipate heat from the device via the aluminum fins which act as a heat absorber and then through a thermal interface material that helps to create an even heat distribution throughout the heat sink structure. The fins work by absorbing heat and dissipating it into the atmosphere. The thermal interface material helps to further reduce the temperature of the aluminum fins, enabling it to quickly and effectively absorb more heat energy.

Conclusion

ATS-09A-63-C3-R0 is a high-performance thermal solution, which makes it a great choice for cooling of electronic devices. It is a cost-effective option compared to other thermal solutions, and it has a wide range of applications in various industry sectors. Additionally, the working principle behind ATS-09A-63-C3-R0 is based on heat sink technology, which further improves its efficiency.

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