ATS-09A-73-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-09A-73-C1-R0-ND

Manufacturer Part#:

ATS-09A-73-C1-R0

Price: $ 3.13
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X10MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09A-73-C1-R0 datasheetATS-09A-73-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.81736
30 +: $ 2.74134
50 +: $ 2.58905
100 +: $ 2.43671
250 +: $ 2.28446
500 +: $ 2.20830
1000 +: $ 1.97985
Stock 1000Can Ship Immediately
$ 3.13
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 28.78°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are some of the most common types of coolers that are commonly used in a number of different applications. The ATS-09A-73-C1-R0 is a thermal device that is used to conduct heat away from vital components of a system and to reduce the overall temperature of the area. Heat sinks are typically designed to provide greater cooling efficiency than many other types of devices, and they are able to maintain a constant ambient temperature level in an area.

The ATS-09A-73-C1-R0 is a two-part design, which consists of a processor and a fan. The processor is responsible for dispersing heat away from the components and the fan is used to cool the processor. When the processor is heated up, the fan will be activated and the processor will be cooled down. This helps to ensure that the device remains cool and prevents overheating. The fan is also used to force air through the heatsink to help lower temperatures in the system.

Most of the ATS-09A-73-C1-R0 heat sinks are manufactured with aluminum, copper, or graphite construction. Some of the more sophisticated models may include a combination of both materials. The design of the heat sink will depend on the size of the processor and the space that it will be placed in. The larger the processor, the larger the dimensions of the heat sink. The materials used in the construction will also be chosen based on the requirements of the system. Copper and aluminum have superior thermal and electrical properties that make them suitable for various types of applications.

Once the ATS-09A-73-C1-R0 has been installed, its working principle is quite simple. The airflow will be directed to the processor and surrounding components through the fan and is drawn away from the processor by the heat sink’s surface. This helps to prevent the overheating of the system. The cooler air that is drawn away from the processor helps to bring the ambient temperature down, which in turn helps to preserve the important components within the system.

The ATS-09A-73-C1-R0 is often used in applications where a larger cooling surface is needed or to cool a high-power component or system. It can also be utilized in smaller systems such as laptops, and desktop computers. Some of the more advanced models feature advanced features such as automatic fan speed control, temperature monitoring, and noise level control. All of these features help to make the ATS-09A-73-C1-R0 an ideal choice for a wide variety of applications.

The ATS-09A-73-C1-R0 is an efficient and reliable device, which is used to keep the components within the system running at a constant temperature. It is usually used in combination with other cooling components such as fans and air-cooled systems. In order to ensure optimal cooling efficiency, the ATS-09A-73-C1-R0 should be regularly maintained and inspected. This will help to ensure that the device is working correctly and to maintain the optimal cooling efficiency of the system.

The specific data is subject to PDF, and the above content is for reference

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