| Allicdata Part #: | ATS15512-ND |
| Manufacturer Part#: |
ATS-09B-02-C2-R0 |
| Price: | $ 3.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09B-02-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.35790 |
| 10 +: | $ 3.26907 |
| 25 +: | $ 3.18100 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.32°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management in modern electronics has become increasingly important. As electronic components and circuit boards become increasingly powerful, more heat must be dissipated in order to ensure optimal performance. Heat sinks are one of the most important tools when it comes to cooling electronics, and one of the more common and popular designs is the ATS-09B-02-C2-R0. This heat sink is designed to transfer heat away from a device design element while at the same time providing important structural support.
The ATS-09B-02-C2-R0 heat sink has an array of features that make it a great choice for thermal management applications. For one, the heat sink has a simple and slim design that makes it easy to install into tight spaces. It is also designed to effectively draw heat away from the part that is being cooled, ensuring optimal performance. Additionally, the heat sink is made of aluminum, making it lightweight and offering a high thermal conductivity. This helps to ensure that heat is quickly and efficiently dissipated.
The design of the ATS-09B-02-C2-R0 is based on a pin-fin design. This refers to the design of the fins on the heat sink, which are designed to draw heat away from the device they are attached to. The pin-fin design is one of the most efficient for thermal management, as it increases the surface area of the fins, allowing for better heat dissipation. Additionally, the pin fins are designed to provide structural support and stability for the device being cooled.
The ATS-09B-02-C2-R0 is an anodized aluminum heat sink designed to meet the thermal management needs of a wide range of applications. It is designed to fit in tight spaces and offers high thermal conductivity. Additionally, its pin-fin design allows for increased surface area which allows for better heat dissipation. This makes it a great choice for applications where heat dissipation and structural support are needed.
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