ATS-09B-10-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-09B-10-C3-R0-ND

Manufacturer Part#:

ATS-09B-10-C3-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09B-10-C3-R0 datasheetATS-09B-10-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.57399
30 +: $ 3.37554
50 +: $ 3.17696
100 +: $ 2.97845
250 +: $ 2.77989
500 +: $ 2.58133
1000 +: $ 2.53168
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks: ATS-09B-10-C3-R0 Application Field and Working Principle

A thermal-heat sink is a key component of a thermal management system, capable of providing thermal support services and maintaining a thermal balance with other parts of the system. ATS-09B-10-C3-R0 is a commonly used thermal-heat sink with a wide range of applications.

ATS-09B-10-C3-R0 thermal-heat sinks are constructed from an aluminum base. They are designed to dissipate thermal energy from their surface while also collecting ambient environmental temperatures. The baseplate has a number of holes for mounting and mechanically supporting additional components, such as fins and coolers. The fins are designed to increase the thermal capacity of the fixture, by allowing a greater area of surface exposure, and by propagating the thermal energy collected by the base plate more efficiently.

The base plate has an internal cooling chamber which contains a liquid thermal-conductive material. This material has the ability to transfer the collected thermal energy to the surrounding environment. By passing a cooling liquid through the chamber, thermal energy is drawn from the rest of the components around it, reducing their temperatures and providing cooling. In addition, this material also provides a thermal conduction path, meaning that the thermal energy collected from the component can be transferred away from the thermal-heat sink and to the surrounding environment.

Aside from its ability to dissipate heat, the design of the ATS-09B-10-C3-R0 thermal-heat sink also allows for various levels of cooling. The provided fins can be built with grooves to further increase the surface area available for cooling, and the cooling liquid used in the cooling chamber can be controlled to create a wider range of cooling ranges. This makes the ATS-09B-10-C3-R0 thermal-heat sink ideal for applications where it is important to maintain a certain ambient temperature level.

In addition to its thermal control features, the design of the ATS-09B-10-C3-R0 also provides advanced mechanical support. The base plate and the fins can be mechanically suspended and supported, providing additional strength and prevention from deformation or breakage. This allows the fixture to be mounted securely in various environments, including areas with wide temperature ranges, without any risk of performance reduction.

The ATS-09B-10-C3-R0 thermal-heat sink is a versatile and efficient product with many potential applications. It is ideal for a variety of thermal management requirements, including cooling, thermal control, and mechanical support. Its ability to collect thermal energy from its base plate and redistribute it through its cooling chamber makes it suitable for applications ranging from semiconductor devices, to robotics, to medical equipment. Moreover, its ability to be configured in various shapes and sizes, and to withstand wide temperature ranges make it suitable for many environments. The ATS-09B-10-C3-R0 thermal-heat sink is a reliable, highly efficient product that can provide thermal support services and maintain a thermal balance for any system.

The specific data is subject to PDF, and the above content is for reference

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