ATS-09B-114-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-09B-114-C1-R0-ND

Manufacturer Part#:

ATS-09B-114-C1-R0

Price: $ 3.12
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X15MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09B-114-C1-R0 datasheetATS-09B-114-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.83689
30 +: $ 2.76024
50 +: $ 2.60694
100 +: $ 2.45360
250 +: $ 2.30023
500 +: $ 2.22355
1000 +: $ 1.99353
Stock 1000Can Ship Immediately
$ 3.12
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.38°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-09B-114-C1-R0 is a thermoelectric air cooler developed by Advanced thermal Solutions, Inc., designed with sufficient cooling capacity to handle both low and high current applications. This device is an excellent choice for applications where precise cooling is required, such as in medical and data center applications.

Application Fields

This type of air cooler lends itself to a variety of applications, including semiconductor cooling, medical instrument cooling, thermal management of data centers, and electronics cooling. It is designed to perform in high-pressure, low-flow environments which makes it ideal for high-performance applications.

This device is designed with a combination of a die cast aluminum extrusion and a finned aluminum membrane. This structure allows the device to be used in a variety of high heat applications, such as high current devices or medical instruments. By using a large heat sink to dissipate heat, the device ensures that the highest cooling effect is achieved with no risk of overheating or damage to the electronics.

The device is also designed to be completely independent, with no need for an external heat sink. This makes it perfect for applications where installing an external heat sink is not possible. It is also designed with an integrated thermoelectric air-to-air heat exchanger which provides better cooling for sensitive applications.

Working Principle

The ATS-09B-114-C1-R0 works as an active cooling device, using a thermoelectric generator (TEG) which converts electrical energy into thermal energy. This type of TEG is based on the seebeck effect, whereby a small current is passed through the device to produce a temperature difference between its two sides, generating a flow of hot or cold air. This hot or cold air flow is then used to cool or heat the device, depending on the application.

The device is designed to be used in a variety of environments, from high heat to low heat, and is also capable of a wide range of adjustability. This means that the user can adjust the energy flow to suit their needs and the application in which they are using the device. It is this adjustability which makes it perfect for medical and data center applications, where precise cooling is required.

The ATS-09B-114-C1-R0 is one of the most advanced cooling solutions available on the market today. With its wide range of applications and ability to precisely regulate airflow, it is an ideal choice for a variety of applications, including semiconductor cooling, medical instrument cooling, thermal management of data centers, and electronics cooling.

The specific data is subject to PDF, and the above content is for reference

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