| Allicdata Part #: | ATS-09B-12-C1-R0-ND |
| Manufacturer Part#: |
ATS-09B-12-C1-R0 |
| Price: | $ 3.44 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09B-12-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13110 |
| 30 +: | $ 3.04668 |
| 50 +: | $ 2.87734 |
| 100 +: | $ 2.70812 |
| 250 +: | $ 2.53885 |
| 500 +: | $ 2.45421 |
| 1000 +: | $ 2.20032 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
ATS-09B-12-C1-R0 application field and working principle
Thermal heat sinks are widely used in many electronics and systems to dissipate heat. The ATS-09B-12-C1-R0 is a specific type of thermal heat sink which is designed to cool processors, modules, and other electronic components. It is one of the most widely used thermal heat sinks on the market for its superior performance and cost-efficiency.
The ATS-09B-12-C1-R0 is composed of an aluminium or copper base, thermal fins, and thermal paste. The base is designed to fit snugly onto the device or component’s external casing and it helps to provide a strong foundation for the heat sink. The fins play an important role in dissipating heat from the component and they feature air-cooling technology that helps to circulate air around the component, accelerating the cooling process. Lastly, the thermal paste helps to create an airtight seal between the base and the component, ensuring maximum heat transfer.
The ATS-09B-12-C1-R0 is capable of dissipating up to 70 Watts and maintains effective cooling under extreme conditions, such as in hot and humid environments. This makes it ideal for processors, modules, and other electronic components that run hotter than average. It can also be used to cool LED or lamp components, as well as any other components that can benefit from additional heat dissipation.
The working principle of the ATS-09B-12-C1-R0 is very straightforward. Heat from the component is conducted to the thermal fins, which act as heat radiators. Heat is then dissipated into the surrounding environment through air-cooling technology and the thermal paste helps to maintain an airtight seal between the cooling fins and the component. This helps to ensure the maximum efficiency of heat dissipation.
In conclusion, the ATS-09B-12-C1-R0 is an excellent thermal heat sink designed to help dissipate heat from hot running processors, modules, and other electronic components. It can also help to cool LED and lamps, and is highly efficient and cost-effective. The key to its superior performance lies in its air-cooling architecture, thermal fins, and thermal paste which ensure maximum heat transfer.
The specific data is subject to PDF, and the above content is for reference