ATS-09B-134-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.44°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-09B-134-C2-R0 Thermal- Heat Sinks Applications and Working Principle

Thermal-Heat Sinks have become a popular tool in a variety of applications. The ATS-09B-134-C2-R0 Thermal-Heat Sink is an example of this technology. It is used to draw heat away from electronic components to prevent them from becoming over-heated or damaged. This article will discuss the applications and working principle of this thermal-heat sink.

In simple terms, a thermal-heat sink is a device that helps dissipate or distribute heat away from an object. The ATS-09B-134-C2-R0 Thermal-Heat Sink is designed specifically for mounting onto computer circuit boards. Mounting the sink to a board helps minimize the amount of heat generated by the chips and other components. It uses a combination of a finned aluminum base and four high-solder heat pipes to draw heat away from high-powered components quickly and efficiently. The fins spread heat over a larger area, capturing heat energy from the components and dissipating it away from the board and into the environment.

Aside from computer circuit boards, the ATS-09B-134-C2-R0 Thermal-Heat Sink is also used for telecommunications, medical, laboratory, and industrial applications. Adjustable stops that attach to the board ensure that the sink is mounted correctly and flush with the board. Heat pipes move heat quickly between components mounted close together and the sink while keeping each component relatively cool, thus reducing device power consumption. This makes it an ideal thermal solution for many industrial and medical applications.

The working principle of the ATS-09B-134-C2-R0 Thermal-Heat Sink is relatively straightforward. Heat from components is absorbed by the finned aluminum base through conduction. Heat pipes transport the heat from the base to the finned heat sink where the heat is spread over a large area. This spreads the heat over a larger area, capturing heat energy from the components and dissipating it away from the board and into the environment. The heat dissipates or is carried away from the board, cooling the components and ultimately leading to increased system performance.

The ATS-09B-134-C2-R0 Thermal-Heat Sink was designed to be an efficient and reliable thermal solution for a variety of applications. It uses a combination of high-solder heat pipes and a finned aluminum base to draw heat away from high-powered components quickly and efficiently. This makes it an ideal thermal solution for many industrial and medical applications. It is quick and easy to install and adjustable stops on the board ensure that the heat sink is mounted correctly and flush with the board. The ATS-09B-134-C2-R0 Thermal-Heat Sink is an ideal thermal-heat solution for a variety of applications.

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