ATS-09B-150-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS15576-ND

Manufacturer Part#:

ATS-09B-150-C2-R0

Price: $ 4.21
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X25MM L-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09B-150-C2-R0 datasheetATS-09B-150-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.83040
10 +: $ 3.72456
25 +: $ 3.51767
50 +: $ 3.31065
100 +: $ 3.10376
250 +: $ 2.89684
500 +: $ 2.68992
1000 +: $ 2.63820
Stock 1000Can Ship Immediately
$ 4.21
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.82°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are a vital part of many electronic applications, particularly applications that generate a significant amount of heat. The ATS-09B-150-C2-R0 is an example of such an application, and understanding its application field and working principle is essential for anyone involved in the design or installation of such systems.The ATS-09B-150-C2-R0 is a thermal interface material, designed to be used between a heatsink and the component to which is transfers heat. It is ideal for applications which require efficient heat conduction with minimum thermal resistance, such as data centers and industrial applications. The material used in the ATS-09B-150-C2-R0 thermal interface is a synthetic fiber material, and it consists of an acrylic adhesive and an aluminum oxide compound. This combination provides excellent conduction of heat, making it ideal for many thermal applications. The application field of the ATS-09B-150-C2-R0 includes many electronic components, such as CPUs, GPUs, and other integrated circuits, as well as automotive and lighting applications. In each of these applications, the ATS-09B-150-C2-R0 is used to connect the component to the heatsink, allowing for efficient heat transfer. The adhesive helps to create a more secure seal between the two components, optimizing the efficiency of this heat transfer.The working principle of the ATS-09B-150-C2-R0 is based on the principle of thermal conduction. Heat from the component is conducted through the material and to the heatsink, dissipating the heat away from the component. This works because the material consists of a combination of materials that are good at conducting heat. The aluminum oxide compound is particularly effective at transferring the heat from the component, and the acrylic adhesive creates a tighter seal to further improve the efficiency of the heat transfer. The combination of the two materials working together makes the ATS-09B-150-C2-R0 an ideal thermal interface material for many electronic and automotive applications. The material is reliable, efficient, and cost effective, and can be easily installed without the need for special tools. With the right application, the ATS-09B-150-C2-R0 can provide an effective solution to your thermal management needs.

The specific data is subject to PDF, and the above content is for reference

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