| Allicdata Part #: | ATS15593-ND |
| Manufacturer Part#: |
ATS-09B-166-C2-R0 |
| Price: | $ 3.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09B-166-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.08700 |
| 10 +: | $ 3.00762 |
| 25 +: | $ 2.92648 |
| 50 +: | $ 2.76381 |
| 100 +: | $ 2.60127 |
| 250 +: | $ 2.43868 |
| 500 +: | $ 2.35738 |
| 1000 +: | $ 2.11351 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.18°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat Sinks are essential parts of any electronic device. They help to dissipate heat away from components, ensuring they remain within acceptable temperature levels. Heat Sinks come in a variety of sizes and shapes, from passive solutions to active solutions. Passive solutions, such as the ATS-09B-166-C2-R0, are used to provide an effective but low-maintenance solution to the challenge of heat dissipation.
The ATS-09B-166-C2-R0 is a heat sink designed to meet the demands of high-airflow environments. Its multi-plate design is constructed out of lightweight aluminum and features two rows of radiator fins designed to maximize efficient heat dissipation. Its patented thermal fins have an excellent thermal conductivity of approximately 4 W/mK, making the ATS-09B-166-C2-R0 an incredibly effective heat sink. Additionally, its multi-plate radiator fins are designed in such a way as to create an ideal airflow pattern within any given environment.
The ATS-09B-166-C2-R0 is a passive heat sink solution and, as such, does not require the installation of any active cooling mechanisms. This type of heat sink works solely on the basis of convection, whereby air is allowed to move freely through the radiator fins and dissipates heat away from the system components. As a result, the ambient temperature around components tends to decrease, ensuring they remain within accepted operational temperatures. Furthermore, the ATS-09B-166-C2-R0 has been designed to be easy to install and requires minimal maintenance.
The ATS-09B-166-C2-R0 is an ideal heat sink solution for any electronic device requiring thermal management. Its lightweight construction and efficient convection system allows for effective heat dissipation even in environments with high-airflow rates. Additionally, its patented thermal fins provide excellent thermal conductivity and efficient heat dissipation, enabling components to remain within accepted operational temperatures. Furthermore, the ATS-09B-166-C2-R0 is easy to install and requires minimal maintenance, making it an optimal choice for any thermal management solution.
The specific data is subject to PDF, and the above content is for reference