ATS-09B-168-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.28°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

ATS-09B-168-C3-R0 Thermal - Heat Sinks

Thermal - Heat Sinks is an electronic component that is commonly used to dissipate heat from electronic components and integrated circuits. The ATS-09B-168-C3-R0 is a high performance thermal heat sink that is designed to efficiently and quickly dissipate heat from hot spots created by dense electronic components and circuit boards when operating at high temperatures.The ATS-09B-168-C3-R0 is a device made of aluminum with multiple fins cut into the aluminum and placed over a heat source such as an integrated circuit. The heat in the circuit board is dissipated by heat conduction via the thermal interface material. As heat is released from the heat source, the edges of the aluminum fins disperse heat evenly and quickly, allowing for efficient cooling.The ATS-09B-168-C3-R0 Thermal - Heat Sink is intended for use on high-power surface mounted devices with limited space. The heat sink has a total height of only 9mm and a width of just 168mm. It comes with a copper base and four self-tapping screws for secure attachment. The base is copper to ensure maximum thermal conductivity and provide a secure attachment.The fins on the ATS-09B-168-C3-R0 are designed to provide a large surface area for cooling. The fins are also arranged in a ‘boxed’ pattern to maximize air flow and improve cooling performance. The fins are also spaced closely together, which improves heat transfer and helps to prevent hot spots.The ATS-09B-168-C3-R0 Thermal - Heat Sink is designed for use in a variety of electronic applications such as laptops, tablets, thin client applications, steady state power supplies, game consoles, and high powered embedded devices. The heat sink is one of the most commonly used thermal management solutions in the industry, due to its efficient cooling performance and easy installability.The ATS-09B-168-C3-R0 is also designed to be used as part of a more complex thermal management system. This system includes other components such as heat pipes, air circulation fans and cooling fans. These components work together to ensure that the system is running at its optimal temperature for maximum performance and energy efficiency.The ATS-09B-168-C3-R0 Thermal - Heat Sink is designed for maximum performance and energy efficiency. It is engineered to provide high-performance cooling, and its efficient design ensures that it remains reliable and durable for many years of use. The heat sink is also easy to install and maintain, and its compact design allows it to be used in tight space. Overall, the ATS-09B-168-C3-R0 is an excellent choice for those looking for efficient thermal management in their electronic applications.

The specific data is subject to PDF, and the above content is for reference