Allicdata Part #: | ATS15605-ND |
Manufacturer Part#: |
ATS-09B-177-C2-R0 |
Price: | $ 4.10 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 35X35X20MM R-TAB T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ATS-09B-177-C2-R0 Datasheet/PDF |
Quantity: | 1000 |
1 +: | $ 3.72330 |
10 +: | $ 3.62061 |
25 +: | $ 3.41939 |
50 +: | $ 3.21817 |
100 +: | $ 3.01701 |
250 +: | $ 2.81588 |
500 +: | $ 2.61474 |
1000 +: | $ 2.56446 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 1.378" (35.00mm) |
Width: | 1.378" (35.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.790" (20.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 6.21°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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The ATS-09B-177-C2-R0 is a type of heat sink, a device that efficiently dissipates the heat generated by electronic components during operation. It is made up of a series of positive and negative thermal conduction components mounted on a metal plate, forming a heat dissipating network. The ATS-09B-177-C2-R0 is designed for larger, more complex installments, as well as smaller, more basic applications.
In addition to its thermal dissipation capabilities, the ATS-09B-177-C2-R0 also offers a number of advantages such as low power consumption, high-efficiency design, extensive range of mounting options, and long shelf life. It is one of the best thermal-based solutions available on the market today.
In terms of its application field and working principle, the ATS-09B-177-C2-R0 works by transferring heat generated by electronic components away from the component itself, allowing it to remain cool while still functioning optimally. This is accomplished through a combination of thermal conduction and convection, which is achieved when the ATS-09B-177-C2-R0 works in tandem with a blower or fan.
The ATS-09B-177-C2-R0 has been designed to work in a wide variety of scenarios, from traditional installations such as server rooms and communications centres to more challenging applications such as high-temperature aerospace environments and mobile devices. The thermal conduction elements are optimized for maximum performance, while the fan\'s speed is adjustable in order to fine-tune the heat dissipation rate.
The design of the ATS-09B-177-C2-R0 is modular, allowing for easy custom installation and maintenance. Furthermore, the device has been engineered to be efficient in both large and small-scale installations. The components can be mounted or positioned in whatever configuration necessary for optimal air flow to be achieved and the components can also be connected via common communication cables.
The ATS-09B-177-C2-R0 is designed to dissipate heat away from sensitive electronic components without any overheating or undue stress on the components. This helps protect the longevity and overall performance of the devices. It is also noteworthy that the ATS-09B-177-C2-R0 is engineered to be both durable and highly reliable.
In summary, the ATS-09B-177-C2-R0 is an extremely efficient and reliable thermal-based solution for dissipating heat away from sensitive electronics components. It can be configured to meet specific needs and requirements, and its modular design ensures easy installation and maintenance. With its combination of thermal conduction, convection, and adjustable fan speed, the ATS-09B-177-C2-R0 offers maximum performance and reliability for both large and small-scale applications.
The specific data is subject to PDF, and the above content is for reference