| Allicdata Part #: | ATS15606-ND |
| Manufacturer Part#: |
ATS-09B-178-C2-R0 |
| Price: | $ 4.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09B-178-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.83040 |
| 10 +: | $ 3.72456 |
| 25 +: | $ 3.51767 |
| 50 +: | $ 3.31065 |
| 100 +: | $ 3.10376 |
| 250 +: | $ 2.89684 |
| 500 +: | $ 2.68992 |
| 1000 +: | $ 2.63820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.82°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important aspect of most electronic devices. Heat spreads resulting in decreased performance, which can lead to premature failure. ATS-09B-178-C2-R0 is a thermal-heat sink solution that helps to manage the temperature of a wide range of electrical components.
ATS-09B-178-C2-R0is a low cost, efficient thermal-heat sink solution for use in a variety of applications, such as semiconductor devices, power modules, and other heating components. It is designed to have a low profile, low profile fitting, and resistance to corrosion. It also can withstand high temperatures and vibration.
The ATS-09B-178-C2-R0 thermal-heat sink is composed of two main components: the heat sink and the fan. The heat sink is a metal alloy structure that provides thermal conductivity to dissipate heat away from the components. The fan is mounted to the heat sink and is responsible for actively cooling the components. It operates by drawing air towards the components, reducing their temperature.
The ATS-09B-178-C2-R0 thermal-heat sink is designed to maintain a consistent, stable temperature. The heat sink disperses heat across its surface area while the fan actively draws air towards it, and the two components work together to ensure that the component temperature remains at an even level. The thermal-heat sink also has an integrated control system which allows it to adjust fan speed depending on the temperature of the components.
The ATS-09B-178-C2-R0 thermal-heat sink is used in a range of applications including computer systems, industrial automation, automotive, military, and telecom equipment. It is also suitable for high-performance applications as it is capable of dissipating heat at a faster rate than conventional sinks.
The ATS-09B-178-C2-R0 is a reliable, efficient and economical thermal-heat sink solution. It is designed to provide a steady, ample cooling flow across a wide range of components making it an ideal choice for many industries. It is readily available and can be easily installed in any component.
The specific data is subject to PDF, and the above content is for reference