| Allicdata Part #: | ATS-09B-183-C3-R0-ND |
| Manufacturer Part#: |
ATS-09B-183-C3-R0 |
| Price: | $ 4.08 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09B-183-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.71322 |
| 30 +: | $ 3.50658 |
| 50 +: | $ 3.30044 |
| 100 +: | $ 3.09412 |
| 250 +: | $ 2.88784 |
| 500 +: | $ 2.68157 |
| 1000 +: | $ 2.63000 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.47°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are a type of cooling system used to decrease the temperature of an electronic device by dissipating heat away from the source relatively evenly, without the use of fans. ATS-09B-183-C3-R0 is a thermal-heat sink in particular that is a compact, cost-effective solution for applications requiring low power dissipation. It is designed to provide maximum heat dissipation with its curved fin technology - the use of slightly curved fins with average spacing creates a more efficient air flow and higher thermal conductivity.
The ATS-09B-183-C3-R0 heat sink is commonly used in applications that require low power dissipation such as laptop computers, small form-factor electronics, and other consumer electronics. With its curved fin technology and low-power design, it is a viable solution for managing heat production in a variety of electronic devices.
The working principle of the ATS-09B-183-C3-R0 heat sink is relatively simple. Heat generated by the device is transferred away from the source by the heat sink to the air through the curved fins on the body. The air passing through the fins further assists in the dissipation of heat as it takes with it the heat absorbed from the heat sink. Additionally, the curved fins are designed to increase the surface area and thus improve the effectiveness of the heat transfer and heat dissipation.
This type of heat sink also offers several key advantages over other conventional heat sinks. First, the curved fins provide increased air flow and thus improved thermal conductivity, resulting in more efficient heat dissipation. Second, its compact design makes it ideal for small form-factor applications such as laptop computers. Third, the curved fin design makes it easier to install and requires minimal tools, resulting in a cost-effective solution. Finally, it can provide superior thermal performance within a limited amount of space, making it an excellent choice for applications that require low power dissipation.
Overall, the ATS-09B-183-C3-R0 heat sink is an effective, low power, cost-effective choice for applications requiring thermal management. Its curved fin technology provides improved airflow, increased thermal conductivity, and decreased size compared to conventional sinks. These features along with its easy-to-install design make it a viable option for a variety of applications.
The specific data is subject to PDF, and the above content is for reference