| Allicdata Part #: | ATS-09B-197-C3-R0-ND |
| Manufacturer Part#: |
ATS-09B-197-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09B-197-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are devices commonly used for the quick removal of excess heat from enclosed spaces like server rooms, high-powered CPUs, laptops, and other electronics. ATS-09B-197-C3-R0 is one such thermal solution in the market that is specifically designed to dissipate thermal energy safely and effectively while promoting optimal user experience. Let\'s take a look at the ATS-09B-197-C3-R0 application field and working principle in more detail.
The ATS-09B-197-C3-R0 thermal solution works using a combination of convection and heat transfer between its various functional components. The device is designed to feature a combination of an aluminum base and heat sink that operate together to quickly and efficiently dissipate thermal energy. Heat is exchanged between the fins of the aluminum base and the heatsink, which helps to draw off and disperse the thermal energy from the device or space it is being installed in. With this effective combination of convection and heat transfer, the ATS-09B-197-C3-R0 makes it possible for users to enjoy their electronics with minimal heat buildup while prolonging device and component life.
So what kind of applications is the ATS-09B-197-C3-R0 designed for? Its main usage is as a solution for quickly cooling down the internal temperature of the device or space it is installed in. This is most applicable to server rooms, high-powered computers, laptops, tablets, and other electronics that generate high temperatures due to their high energy usage. By having the device installed, users can enjoy their electronics without the worry of overheating or reduced performance due to high temperatures.
Another application area of the ATS-09B-197-C3-R0 device is in automotive electronics. The device can be used as a thermal cooling solution in automotive applications such as engine cooling, transmission cooling, and brake cooling. By having the device installed, automotive electronics can maintain a cooler internal temperature even under extended and heavy use, thus prolonging the lifespan and reliability of the device.
Finally, the ATS-09B-197-C3-R0 thermal solution can also be used as a cooling device in complete network and system designs. This makes it ideal for densely packed electronic components or systems that are exposed to direct sunlight or have limited access to air cooling. With the device installed, users can rest assured that their electronics and networks will continue to operate efficiently without the worry of overheating.
In conclusion, ATS-09B-197-C3-R0 is a thermal solution specifically designed to quickly and efficiently dissipate thermal energy from devices and spaces while promoting optimal user experience. The device is most suitable for applications such as server rooms, high-powered CPUs, automotive electronics, and complete network and system designs. With the device installed, users can rest assured that their electronics and systems will continue to operate efficiently and remain cooler even under prolonged usage.
The specific data is subject to PDF, and the above content is for reference