| Allicdata Part #: | ATS-09B-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-09B-20-C1-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09B-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58470 |
| 30 +: | $ 3.38583 |
| 50 +: | $ 3.18654 |
| 100 +: | $ 2.98746 |
| 250 +: | $ 2.78828 |
| 500 +: | $ 2.58911 |
| 1000 +: | $ 2.53931 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-09B-20-C1-R0 is a thermal cooling device designed to provide heat dissipation for applications where passive cooling is not a viable option. It is part of the thermal-heat sink family, a group of cooling solutions designed to dissipate heat from individual components, such as CPUs, GPUs, etc. Properly designed and installed, these devices can reduce ambient temperatures, ensuring the reliability of the components they are cooling. In this article, we will discuss the applications and working principles of the ATS-09B-20-C1-R0.
Applications
The ATS-09B-20-C1-R0 is primarily used in high-performance computing applications. This includes applications where extended operating temperatures are common, such as gaming systems, workstations, and enterprise server systems. The device is also suitable for overclocking, enabling performance increases without compromising stability.
In addition to the above applications, the ATS-09B-20-C1-R0 can also be used in consumer electronics, such as smartphones and tablets. As these devices become increasingly powerful, the need for reliable cooling solutions becomes ever more critical. The device\'s size and versatility make it an ideal choice for these applications.
Working Principle
The ATS-09B-20-C1-R0 utilizes a combination of thermally conductive materials and a unique design to provide efficient heat dissipation. It features an array of semi-conductive fins which increase the surface area, providing greater convective heat dissipation. The fins are positioned so that air can be directed in a focused manner which promotes laminar airflow, providing more efficient heat dissipation.
Passive cooling is not enough for high-performance applications, however, and the device also features active cooling solutions. It utilizes a combination of fans and heat pipes to further draw heat away from the components. The heat pipes also improve the thermal conduction between the device and the components, providing improved cooling performance. Fans are designed to provide quiet operation, and may be configured according to the specific needs of the application.
Conclusion
The ATS-09B-20-C1-R0 is a thermal-heat sink designed to provide efficient heat dissipation for high-performance applications. It utilizes a combination of thermally conductive materials, convective cooling, and active solutions to ensure components remain reliably cooled. It is suitable for a wide range of applications, including gaming systems, workstations, overclocking, and consumer electronics.
The specific data is subject to PDF, and the above content is for reference