| Allicdata Part #: | ATS-09B-28-C1-R0-ND |
| Manufacturer Part#: |
ATS-09B-28-C1-R0 |
| Price: | $ 6.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09B-28-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.54337 |
| 30 +: | $ 5.23551 |
| 50 +: | $ 4.92748 |
| 100 +: | $ 4.61954 |
| 250 +: | $ 4.31157 |
| 500 +: | $ 4.00360 |
| 1000 +: | $ 3.92661 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.57°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are used for a wide variety of applications, including thermoelectric cooling, high temperature electronics, and energy harvesting. The ATS-09B-28-C1-R0 heat sink dissipates heat from high-power electronics components and components under a wide range of operating temperatures. The heat sink is designed to absorb and release thermal energy generated by the component in an efficient manner.
The ATS-09B-28-C1-R0 heat sink utilizes a combination of air flow, gas flow, and surface area to maximize heat dissipation. The gas flow is designed to flow parallel to the component’s surface area for maximum heat transfer. It is also designed to be highly efficient and allow for high operating temperatures and minimal thermal loss. The surface area of the heat sink provides additional thermal transfer by dissipating heat away from the component in an efficient manner.
The ATS-09B-28-C1-R0 also features multiple unique features designed to make operation easier and to provide enhanced performance. Its integrated fans feature two fan speeds which can be adjusted for optimal heat dissipation. It also features a multi-zone control system that allows for optimal thermal management and energy efficiency. The control system also allows for controlling the amount of current and voltage supplied to the heat sink to provide the best performance.
The ATS-09B-28-C1-R0 also features multiple mounting options, which allows it to be easily installed and configured in a variety of configurations. It also features a robust construction design that ensures reliable thermal protection and optimal efficiency over a wide range of temperatures. The heat sink also features insulated contact points that ensure optimal thermal conductivity and heat dissipation.
In addition to its efficient heat transfer capabilities, the ATS-09B-28-C1-R0 also offers multiple safety features. Built-in temperature sensors enable the heat sink to shut off when temperature levels reach dangerous levels. This prevents component damage and ensures safe operation of the component. The heat sink also features a patented design that minimizes the risk of electric shock.
The ATS-09B-28-C1-R0 heat sink is an effective solution for dissipating heat from high power electronics components and components in a wide range of operating temperatures. Its efficient heat transfer capabilities combined with its multiple mounting and safety features make it a reliable, efficient, and safe option for dissipating heat. Its unique design and features make it a great option for those looking to maximize performance and protect their electronic components from damage.
The specific data is subject to PDF, and the above content is for reference