| Allicdata Part #: | ATS-09B-28-C3-R0-ND |
| Manufacturer Part#: |
ATS-09B-28-C3-R0 |
| Price: | $ 7.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09B-28-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.73218 |
| 30 +: | $ 6.35796 |
| 50 +: | $ 5.98387 |
| 100 +: | $ 5.60990 |
| 250 +: | $ 5.23590 |
| 500 +: | $ 4.86191 |
| 1000 +: | $ 4.76841 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.62°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction
Thermal - Heat Sinks are an essential part of any electronics system. A heat sink helps manage the thermal load of a system and directs the heat away from critical components, as well as dissipating it into the ambient environment. Heat sinks are typically constructed from metal with multiple fins to improve thermal performance. Typical components which need the help of a heat sink are microprocessors, digital logic gates, RF power amplifiers, and various other high-power components.
The ATS-09B-28-C3-R0 is a thermal management device from Allied Elecroncs, designed for on-board cooling of power electronics subsystems such as LED lighting, motor controllers, or other heat-producing electronic systems. The ATS-09B-28-C3-R0 is a high-performance thermal management device, with aluminum-finned extrusion heat sinks to enhance heat dissipation. Additionally, its built-in fan helps to further channel the thermal load to external systems.
Application Field
The ATS-09B-28-C3-R0 is highly suitable for a range of applications, including LED lighting, motor controllers, and other electronics. It is capable of dissipating significant amounts of heat in highly efficient packages. Its aluminum-finned extrusion design allows the device to operate at high temperatures as it is capable of transferring greater amounts of heat.
The device is suitable for cooling applications where large areas of exposed heat-generating electronics is present. As the device consists of an aluminum extrusion heat sink, it is highly suited for thermal dissipation of high-power components such as microprocessors, MOSFETs, IGBTs, and similar.
Working Principle
The ATS-09B-28-C3-R0 employs an aluminum-finned extrusion heat sink design, which is highly capable of transferring and dissipating heat from high-power components. The device’s optimized fin design maximizes the surface area for maximum heat transfer performance. The device’s built-in fan helps to channel the thermal load to external systems where it can be safely dissipated.
The device also employs a PWM fan control to ensure quiet operation. The fan speed can be controlled from a PWM input or via an external thermistor. The device’s fan control feature ensures that it runs at optimal performance at all times.
The device also has a low-profile design, making it suitable for applications with limited space or enclosure size constraints. The device is also RoHS-compliant, making it an excellent choice for energy-efficient applications.
Conclusion
The ATS-09B-28-C3-R0 is an efficient and highly capable thermal management device, designed for on-board cooling of power electronics subsystems such as LED lighting, motor controllers, or other heat-producing electronic systems. The device’s optimized fin design maximizes the surface area for maximum heat transfer performance, while its built-in fan helps to channel the thermal load to external systems where it can be safely dissipated. This makes the device an excellent choice for energy-efficient applications where space is limited.
The specific data is subject to PDF, and the above content is for reference