ATS-09B-37-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-09B-37-C3-R0-ND

Manufacturer Part#:

ATS-09B-37-C3-R0

Price: $ 5.85
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 36.83X57.6X17.78MM T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09B-37-C3-R0 datasheetATS-09B-37-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.26302
30 +: $ 4.97049
50 +: $ 4.67813
100 +: $ 4.38575
250 +: $ 4.09336
500 +: $ 3.80098
1000 +: $ 3.72789
Stock 1000Can Ship Immediately
$ 5.85
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 1.450" (36.83mm)
Width: 2.267" (57.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.700" (17.78mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.19°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-09B-37-C3-R0 thermal heat sink is a widely used cooling system with an optimal cooling capacity. This type of thermal heat sink is specifically designed to dissipate heat from power industrial electronics, personal computers, semiconductor devices, and other electronic components.

The ATS-09B-37-C3-R0 thermal heat sink is constructed with a strong aluminum core, which is then covered with a thermally conductive coating. This core serves to absorb and disperse the heat away from the electronic components. The thermally conductive coating improves the heat transfer efficiency by further dissipating heat away from the core and ensuring that heat is evenly distributed.

The ATS-09B-37-C3-R0 thermal heat sink is designed with a fan bracket that can hold one or two fans for improved cooling. This fan or fans draw air across the entire thermal heat sink, which results in improved cooling. The fan bracket also enables airflow around the outside of the heatsink itself, allowing for greater cooling capacity. The additional air movement also helps to reduce the amount of thermal shrinkage, making the heatsink more reliable.

Thermal heat sinks such as the ATS-09B-37-C3-R0 are often used in areas where high temperatures and space limitations are an issue. For example, they are commonly used in telecommunications networks, where extreme temperatures are often present. The thermal heat sink is small and lightweight, so it does not take up a lot of space in the communication racks. Additionally, the high thermal conductivity of the metal core ensures that the heatsink is able to maintain efficient cooling performance even in extreme temperatures.

The ATS-09B-37-C3-R0 thermal heat sink also offers a cost-effective solution for those looking to reduce operating costs in their applications. Since the aluminum core absorbs and dissipates the majority of the heat produced, it reduces the need for expensive fans and cooling systems. This reduces the amount of electricity and energy needed to run the overall system, allowing for savings in both energy and money.

With its aluminum core and thermally conductive coating, the ATS-09B-37-C3-R0 thermal heat sink offers an efficient and cost-effective solution for cooling large electronic components. Its fan bracket and easy installation make it an ideal choice for businesses looking to reduce their cooling costs in industrial, telecommunications and personal computer applications. The strong aluminum core ensures that heat is evenly dissipated away from the components, while the thermally conductive coating further improves heat transfer efficiency.

The specific data is subject to PDF, and the above content is for reference

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