Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	1.450" (36.83mm)
Width:	2.267" (57.60mm)
Diameter:	--
Height Off Base (Height of Fin):	0.900" (22.86mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.40°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: The ATS-09B-38-C1-R0

Heat sinks have been around for many years, but until recently, their use in consumer products has been limited. However, the introduction of the ATS-09B-38-C1-R0 has opened up a wide range of possibilities for thermal management in many different applications. In this article, we will take a look at the application field and working principle of the ATS-09B-38-C1-R0.First and foremost, the ATS-09B-38-C1-R0 is a heat sink designed specifically for cooling electronics. It is typically designed as a single unit that is suspended from the main body of the device. This allows the heatsink to be positioned in the optimal location for maximum cooling efficiency.In terms of its application field, the ATS-09B-38-C1-R0 can be found in a wide range of consumer electronics. This includes home electronics such as TVs, laptops and game consoles as well as a variety of industrial applications. For example, it is commonly used in high-speed data processing and network server racks.The ATS-09B-38-C1-R0 works by using a combination of aluminum, copper and titanium to absorb and then dissipate the excess heat away from the main body of the device. It does this by creating an air gap between the heat source and the heat sink. This air gap acts as a thermal buffer, allowing heat to be transferred away from the main body of the device to the heat sink.The ATS-09B-38-C1-R0 features a wide array of fins that are designed to absorb the heat from the device. These fins are connected to a central core that is also connected to the main body of the device. The central core is designed to efficiently dissipate the absorbed heat away from the device.In addition to the main body of the device, the ATS-09B-38-C1-R0 also features several additional components. These include a thermal pad and a fan. The thermal pad is designed to help conduct the heat away from the main body of the device. It is typically made from high-grade thermal material that is designed to last for many years. The fan is also designed to help dissipate the heat absorbed from the device. This fan is typically made from a high-grade fan blade material that is designed to have an aerodynamic profile. This allows the fan to generate more airflow while remaining quiet.In conclusion, the ATS-09B-38-C1-R0 is an effective heat sink designed specifically for thermal management in a wide range of applications. Its use of aluminum, copper and titanium to absorb and dissipate heat makes it an ideal choice for many consumer and industrial products. The inclusion of a thermal pad and fan also make it an even more efficient and robust cooling solution.

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