ATS-09B-40-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS-09B-40-C2-R0-ND

Manufacturer Part#:

ATS-09B-40-C2-R0

Price: $ 6.45
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X60.96X11.43MM T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09B-40-C2-R0 datasheetATS-09B-40-C2-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.80671
30 +: $ 5.48436
50 +: $ 5.16172
100 +: $ 4.83909
250 +: $ 4.51647
500 +: $ 4.19386
1000 +: $ 4.11320
Stock 1000Can Ship Immediately
$ 6.45
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 2.400" (60.96mm)
Diameter: --
Height Off Base (Height of Fin): 0.450" (11.43mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 14.56°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction to ATS-09B-40-C2-R0 Thermal - Heat Sinks

In electronics, heat sinks are important components of thermal management. These thermal management tools help improve the performance of electronic equipment by removing excess heat from the working components and keeping them cool. As a result, the electronic devices are able to function optimally without running the risk of overheating and other problems.

The ATS-09B-40-C2-R0 Thermal - Heat Sinks are one of the most ideal products for cooling applications in the electronics industry. This heat sink is made from high-quality aluminum alloy material that is designed to dissipate heat quickly and effectively. This heat sink features a ribbed design that helps to increase airflow, thus enhancing the heat dissipation capabilities. Additionally, it also has a large fin area which helps to evenly distribute the heat over a much larger area, allowing it to dissipate heat more effectively. As a result, the ATS-09B-40-C2-R0 is the perfect tool for cooling applications in the electronics industry.

Application Field and Working Principle of ATS-09B-40-C2-R0 Thermal - Heat Sinks

The ATS-09B-40-C2-R0 Thermal - Heat Sinks are designed for use in various cooling applications, such as computers, power supplies, and other electronics components. This heat sink works on the same principle as other heat sinks: it is constructed to transfer heat away from a source using a combination of thermal conduction, thermal radiation, and convection. In conduction, the heat from the source is transferred through the heat sink’s aluminum alloy body to the fins of the heat sink. The fins then act as a radiator, transferring the heat to the surrounding air, while the airflow is increased due to the convection. Finally, the heat is radiated away from the equipment using radiation.

The ATS-09B-40-C2-R0 Thermal - Heat Sinks are an excellent choice for cooling applications in the electronics industry. Its large fin area and enhanced ribbed design are specifically designed to dissipate heat quickly and efficiently, allowing the electronics components to remain at proper temperatures for a long time. Furthermore, its aluminum alloy construction ensures excellent durability, making this heat sink a reliable choice for long-term cooling needs.

Conclusion

The ATS-09B-40-C2-R0 Thermal - Heat Sinks are a perfect choice for a wide range of cooling applications in the electronics industry. This heat sink utilizes a combination of thermal conduction, thermal radiation, and convection to transfer heat away from a source, ensuring that its components remain at proper working temperatures for extended periods of time. Furthermore, its large fin area, enhanced ribbed design, and aluminum alloy construction provide excellent durability, making this an ideal choice for long-term cooling needs.

The specific data is subject to PDF, and the above content is for reference

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