
Allicdata Part #: | ATS-09B-46-C1-R0-ND |
Manufacturer Part#: |
ATS-09B-46-C1-R0 |
Price: | $ 3.25 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 25X25X25MM L-TAB |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 2.95470 |
30 +: | $ 2.87490 |
50 +: | $ 2.71505 |
100 +: | $ 2.55541 |
250 +: | $ 2.39567 |
500 +: | $ 2.31582 |
1000 +: | $ 2.07625 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 0.984" (25.00mm) |
Width: | 0.984" (25.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 11.50°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important factor for a variety of applications. Heat sinks effectively dissipate heat away from components, protecting their integrity and ensuring proper operation. The ATS-09B-46-C1-R0 is one such product designed to cool electronic components and produce a cooling solution. This product is termed as a high performance heat sink.
The ATS-09B-46-C1-R0 is designed to provide maximum heat dissipation while maintaining a low profile. It features a natural anodized finish to ensure a low contact resistance between the heat sink and heat source. It is designed to allow for air to circulate under the heat sink, for improved performance. This enables the product to remain cool while running all day. This product also features a range of mounting holes to prevent unwanted movement when used in combination with vibration inducing applications.
It is specifically designed for a wide range of applications that require superior thermal management. These include processors, audio amplifiers, or any other high-power electronics that require efficient cooling. This product is also ideal for use in \'hot spots\' that require high-power, efficient, and localized heating solutions.
The ATS-09B-46-C1-R0 conduction-cooled heat sink utilizes a heat-pipe cooling mechanism. This cooling system employs the principles of thermodynamics to transfer heat away from the processor quickly and efficiently. Heat is drawn from the processor and transferred to the heat pipe, which then dissipates the heat to the ambient air. The heat pipe increases the thermal management efficiency of the unit by absorbing and dissolving the heat from the processor into the fluid inside the heat pipe. This fluid then conducts the heat away from the processor and dissipates it in the surrounding air.
The ATS-09B-46-C1-R0 is constructed from aluminum, which is a very thermally conductive material. Its excellent heat dispersion qualities make it perfect for utilizations that require a large amount of heat transfer such as the ATS-09B-46-C1-R0 application field. Aluminum also allows for improved heat transfer efficiency while remaining lightweight. This material allows for an optimized thermal cycle that ensures the product remains stable even under high power load. The aluminum is also corrosion-resistant to provide added durability in the unit.
As previously mentioned, The ATS-09B-46-C1-R0 is designed to be mounted in tight spaces. It has a small footprint, allowing for efficient propulsion and maximum performance. Additionally, its efficient cooling design ensures low power consumption and improved longevity. With its combination of materials, conduction-cooled heat pipe design, and increased heat dispersion, the ATS-09B-46-C1-R0 has what it takes to provide efficient thermal management and superior protection for a variety of high-power electronics.
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