ATS-09B-46-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-09B-46-C3-R0-ND

Manufacturer Part#:

ATS-09B-46-C3-R0

Price: $ 3.51
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X25MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09B-46-C3-R0 datasheetATS-09B-46-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.18591
30 +: $ 3.09981
50 +: $ 2.92774
100 +: $ 2.75549
250 +: $ 2.58325
500 +: $ 2.49714
1000 +: $ 2.23882
Stock 1000Can Ship Immediately
$ 3.51
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.84°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Heat dissipation and cooling are necessary components of any energy-intensive application as ensuring safe and efficient operation of computer systems, electronic appliances, power electronics, and other applications. The ATS-09B-46-C3-R0 heat sink, which is a passive, thermoelectric cooling device, is designed to meet this need. In this article, we will discuss the application field and working principle of the ATS-09B-46-C3-R0 heat sink.

The ATS-09B-46-C3-R0 heat sink is designed to dissipate heat from electrical and electronic components used in a variety of applications. It is an epoxy-based heat sink, allowing it to be extremely thin and lightweight yet highly effective. The ATS-09B-46-C3-R0 is designed with a high degree of precision, allowing for accurate heat distribution throughout the surface of the heat sink. This ensures that the device can maintain a consistent environment without having to constantly adjust its settings.

The ATS-09B-46-C3-R0 is a thermoelectric cooling device, meaning that it uses thermoelectric cooling elements to regulate the temperature of a given surface. The thermoelectric cooling elements used in the ATS-09B-46-C3-R0 are made up of a semiconductor material which, when connected to a power source, acts as an electrically-insulated material. This insulation allows the ATS-09B-46-C3-R0 to remain stationary when in operation, while at the same time allowing the heat to disperse into the surrounding environment. The thermoelectric cooling element helps the heat sink to dissipate heat without the need of a fan or active component.

The ATS-09B-46-C3-R0 heat sink is designed to be applied in a variety of applications, including those related to computers, electronics, and power electronics. It is specifically designed to provide reliable and efficient cooling in applications such as desktop computers, server racks, digital signage, and other high-density electronic components. The ATS-09B-46-C3-R0 is a cost-effective solution for a wide range of applications, as it provides both heat dissipation and cooling in a single assembly.

In conclusion, the ATS-09B-46-C3-R0 heat sink is a passive, thermoelectric cooling device designed to provide efficient and reliable cooling in a variety of applications. It is designed with a high degree of precision and is made of an epoxy material which allows for accurate heat distribution. The thermoelectric cooling element of the ATS-09B-46-C3-R0 provides heat dissipation without the need of a fan or active component. The ATS-09B-46-C3-R0 is a cost-effective solution for many different applications, as it provides both heat dissipation and cooling in a single assembly.

The specific data is subject to PDF, and the above content is for reference

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