ATS-09B-53-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.57°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-09B-53-C2-R0 Thermal - Heat Sink

Thermal - heat sinks are an integral part of many electronic components. ATS-09B-53-C2-R0 is a type of heat sink specifically designed to dissipate away heat generated by electronics, dissipate heat, minimize temperature rise, and improve the overall performance of the system.

Application Field of ATS-09B-53-C2-R0 Thermal - Heat Sink

ATS-09B-53-C2-R0 is designed for applications that require high performance and small size. It is suitable for use in tight spaces, where size is a major concern. This heat sink is particularly popular in embedded applications where space considerations could limit the performance of a component. It is also frequently used in power electronics applications, where cooling is critical to prevent performance oscillations and thermal drift. Other uses include communications, computing, medical, military, automotive, and consumer electronic devices.

Materials for ATS-09B-53-C2-R0 Thermal - Heat Sink

The ATS-09B-53-C2-R0 thermal - heat sink is made of aluminum. This material provides excellent thermal properties along with light weight, cost effectiveness, and durability. Aluminum is a popular choice for heat sinks due to its ability to transfer heat quickly and efficiently. Furthermore, aluminum is corrosion resistant, so it can be used in a variety of environments.

Working Principle for ATS-09B-53-C2-R0 Thermal - Heat Sink

The ATS-09B-53-C2-R0 thermal - heat sink operates by dissipating heat through two primary mechanisms: convection and radiation. Convection involves the transfer of heat from one material to another, via an intervening medium such as air. In the case of the ATS-09B-53-C2-R0 thermal - heat sink, the aluminum works as the intermediary, allowing the heat to be transferred away from the source. Radiation, on the other hand, involves the direct transmission of heat energy through electromagnetic waves. The ATS-09B-53-C2-R0 thermal - heat sink can absorb heat energy from its surroundings and radiate it back out to the environment.

Design Features of ATS-09B-53-C2-R0 Thermal - Heat Sink

The design of the ATS-09B-53-C2-R0 thermal - heat sink includes a number of features that help to increase its effectiveness. The heat sink is designed with an angled profile to maximize surface area and increase airflow. This allows the heat sink to transfer more heat away from the source and increase the system\'s overall performance. Additionally, the design also includes fins and channels that work to optimize air flow and heat dissipation. These features make the ATS-09B-53-C2-R0 thermal - heat sink well suited for use in tight spaces.

Conclusion

The ATS-09B-53-C2-R0 Thermal - Heat Sink is an effective solution for dissipating heat from electronic components. Its aluminum construction provides excellent thermal properties, making it an ideal choice for applications where size is a major factor. Furthermore, its angled profile, fins, and channels provide enhanced air flow to improve its overall performance. This makes the ATS-09B-53-C2-R0 Thermal - Heat Sink an ideal choice for a wide range of applications.

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