ATS-09B-63-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.42°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction
ATS-09B-63-C3-R0 thermal- heat sinks is a type of heat dissipation device that consists of an aluminum body, fins, and a base material. The aluminum body helps to dissipate heat from the center of the device, while the fins increase the surface area, allowing for greater heat dissipation. Heat sinks are popular among industrial machinery, electronic circuits, transistors, and computer processors to effectively keep them cool, resulting in improved performance and reliability.Application Field
ATS-09B-63-C3-R0 thermal- heat sinks provide effective dissipating solutions for applications such as optical and plant automation. They serve as an effective way to manage and reduce temperature in varied types of devices. When used in photo printers, dye lasers, and other optical systems, these sinks allow for adequate cooling to reduce the temperatures of the components involved. In the field of plant automation, thermal- heat sinks are used to dissipate the excess heat generated due to the continuous operation of motors and other equipment, thus increasing the reliability and performance of the machine.Working Principle
The working principle of ATS-09B-63-C3-R0 thermal- heat sinks is based on the principle of convection. This process is known as natural convection and involves the transfer of heat from the heat source to the heat sink. In this process, the air surrounding the sink is warmed by the heat from the source, causing it to become less dense than the air above it. This causes a low-pressure area to form, which results in air flowing from the lower pressure area to the higher pressure area. As the air continues to flow, it absorbs the heat from the heat source and carries it away, cooling it down until it is eventually released from the heat sink.Advantages
ATS-09B-63-C3-R0 thermal- heat sinks have a number of advantages when compared to other heat dissipation methods, such as air-cooled and water-cooled systems. Firstly, they require minimal maintenance as all that is necessary is to ensure that the surrounding fins are free of dust and debris for maximum performance. Secondly, they are cost-effective and require less energy, as they use the natural convection process to dissipate the heat generated.This also means that they can offer a high degree of heat dissipation with minimal power consumption compared to other cooling methods. Lastly, they are compact and lightweight, making them ideal for tight spaces or areas with limited space.Conclusion
ATS-09B-63-C3-R0 thermal- heat sinks are ideal for dissipating excess heat in devices and components. With their low maintenance costs, high degree of heat dissipation, and cost-effectiveness, they are becoming increasingly popular in industrial machines and electronics. By utilizing natural convection, these sinks provide an effective way to manage temperature and reduce energy consumption. As such, they are an excellent choice for both optical and plant automation applications.

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