| Allicdata Part #: | ATS-09B-65-C3-R0-ND |
| Manufacturer Part#: |
ATS-09B-65-C3-R0 |
| Price: | $ 4.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09B-65-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.15233 |
| 30 +: | $ 3.92175 |
| 50 +: | $ 3.69104 |
| 100 +: | $ 3.46040 |
| 250 +: | $ 3.22971 |
| 500 +: | $ 2.99902 |
| 1000 +: | $ 2.94134 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.40°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for the reliable operation of electronic devices and systems. Effective thermal management is accomplished in many ways, one of which is by using dedicated heatsinks. ATS-09B-65-C3-R0 is one such heatsink that is designed to provide efficient thermal management for multiple applications. This article will provide an overview of the ATS-09B-65-C3-R0 application field and working principle.
The ATS-09B-65-C3-R0 is a high-performance extruded aluminum heatsink with a thermal resistance of 0.40°C/W. The heatsink is designed for a wide range of applications, including LED lighting, telecom, consumer electronics, telecom, medical, automotive, and other industries. The heatsink has a wide variety of mounting options, ensuring that it can be used for both through-hole and surface-mount applications accommodating both vertical and horizontal orientations. It is also corrosion-resistant and is therefore suitable for environments where moisture and other corrosive agents are present.
One of the most important aspects of any heatsink is its ability to dissipate heat from a device or system. The ATS-09B-65-C3-R0 heatsink is designed to achieve maximum thermal dissipation for a variety of applications. It features an optimized fin structure that facilitates increased air-flow and an extremely efficient cooling system. In addition, the heatsink utilizes a unique design that reduces the sound intensity emitted by the system. This ensures that the system can operate without adversely affecting the acoustic performance of the environment.
The working principle of the ATS-09B-65-C3-R0 heatsink is relatively straightforward. It utilizes a combination of convection and conduction to draw heat from the device or system and then dissipate it to the surrounding environment. During operation, air is drawn through the fin structure of the heatsink, effectively transferring heat away from the device or system. The air then passes through an air-cover where the fins are given more surface area to dissipate heat. Finally, air is expelled from the heatsink and the cycle begins again.
The ATS-09B-65-C3-R0 is a highly efficient and reliable heatsink that is designed for a variety of applications. Its optimized fin structure ensures maximum thermal dissipation while its unique design reduces sound intensity. This makes it an ideal choice for thermal management of multiple applications and environments. As the electronics industry continues to innovate, the demand for more efficient thermal management solutions will only increase and the ATS-09B-65-C3-R0 is the ideal solution.
The specific data is subject to PDF, and the above content is for reference