| Allicdata Part #: | ATS-09B-76-C3-R0-ND |
| Manufacturer Part#: |
ATS-09B-76-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09B-76-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are designed to dissipate heat away from certain components or platforms, helping them to maintain lower operating temperatures for optimum performance. The ATS-09B-76-C3-R0 is a popular thermal heat sink that is designed for applications requiring high thermal performance and reliability. It features an optimized cold plate design that provides maximum allowable surface contact, allowing for efficient heat transfer to the fin material. The device also includes an integrated fan for heat circulation, allowing for lower temperatures to be maintained in larger open-air applications.
The ATS-09B-76-C3-R0 offers superior performance and reliability, compared to many other thermal heat sinks available on the market. The integrated fan allows for increased airflow, providing improved cooling efficiency. The fan also offers silent operation and energy efficient design, helping to reduce power consumption. Additionally, aluminum extrusions provide a lightweight and easy to install solution, while the ribbed top fin design increases the thermal area and surface contact.
In terms of application field, the ATS-09B-76-C3-R0 is mainly used in electronics and electrical equipment that require reliable heat dissipation and low operating temperatures. This includes a variety of consumer electronics, such as laptops, smartphones, and gaming consoles. The device is also often used in industrial applications where precise temperature management is required, such as process control systems, medical treatment equipment, and military defense systems.
Moving on to the device’s working principle, the ATS-09B-76-C3-R0 has a two part cooling system. The first is a solid-state, passive cooling system, in which the heat is transferred directly from the heated component or platform to the heat-sink. The second is an active cooling system, in which the fan draws cold air from outside the platform, and circulates it through the device. This allows for improved cooling performance and energy efficiency.
Overall, the ATS-09B-76-C3-R0 is an effective and reliable thermal heat sink that is suitable for various applications. Its lightweight, easy to install design and integrated fan offer increased cooling performance and silent operation. Additionally, its optimized cold plate design provides an increased thermal contact area, resulting in improved thermal transfer.
The specific data is subject to PDF, and the above content is for reference