| Allicdata Part #: | ATS-09B-81-C1-R0-ND |
| Manufacturer Part#: |
ATS-09B-81-C1-R0 |
| Price: | $ 3.31 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09B-81-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.00195 |
| 30 +: | $ 2.92068 |
| 50 +: | $ 2.75839 |
| 100 +: | $ 2.59610 |
| 250 +: | $ 2.43384 |
| 500 +: | $ 2.35272 |
| 1000 +: | $ 2.10933 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a key component of a range of products and processes, and heat sinks are used to transfer thermal energy from a device or system to the ambient environment. The ATS-09B-81-C1-R0 heat sink is an advanced thermal solution designed to optimize performance and minimize energy losses in more efficient computing, communication and aerospace applications.
Design and Construction
The ATS-09B-81-C1-R0 heat sink is constructed of high-performance aluminum alloy with an anodized aluminum finish, and the finned extrusion design allows for an efficient heat transfer. The heat sink has an optimized interface with integrated mounting clips, and its design allows for multiple cooling configurations and air flow paths. The unit is mechanically pressurized for optimal contact with the heat source, and its low profile design makes the unit easy to install in confined spaces. The integrated mounting clips also ensure that the heat sink is secure and will not move.
I-TEC Technology
The ATS-09B-81-C1-R0 heat sink is also equipped with the advanced I-TEC technology, which provides both passive and active cooling performance. This technology utilizes thermoelectric cooling elements to actively cool the heatsink, and is capable of cooling up to 60W of power. These thermoelectric elements are able to regulate the temperature of the heat sink, which improves the efficiency of the overall system.
Application Fields and Working Principle
The ATS-09B-81-C1-R0 heat sink is suitable for a variety of thermal applications ranging from high-performance compute and communications systems to aerospace applications. The heat sink is designed to effectively transfer thermal energy from the heat source to the ambient environment, and its efficient design helps to reduce energy losses. In addition, the I-TEC technology can provide active cooling necessary for high-performance applications.
Performance and Benefits
The ATS-09B-81-C1-R0 heat sink offers a wide range of benefits, including improved thermal performance, decreased energy losses, and increased system stability. The I-TEC technology also ensures that the heat sink can adapt to the system load and environment, which ensures optimal performance and energy efficiency. In addition, the unit is designed for easy installation, and its low profile design makes it ideal for use in confined spaces.
Conclusion
The ATS-09B-81-C1-R0 heat sink is an advanced thermal solution suitable for use in a wide range of applications. The unit is constructed of high-performance aluminum alloy and features an anodized aluminum finish. It is also equipped with I-TEC technology, which provides both passive and active cooling solutions. The heat sink is designed to effectively dissipate thermal energy and is suitable for use in high-performance computing and communications systems as well as aerospace applications.
The specific data is subject to PDF, and the above content is for reference