| Allicdata Part #: | ATS15706-ND |
| Manufacturer Part#: |
ATS-09B-97-C2-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X10MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09B-97-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.93750 |
| 10 +: | $ 3.82851 |
| 25 +: | $ 3.61595 |
| 50 +: | $ 3.40326 |
| 100 +: | $ 3.19051 |
| 250 +: | $ 2.97781 |
| 500 +: | $ 2.76511 |
| 1000 +: | $ 2.71193 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.30°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are used to disperse heat away from a particular area by conducting the heat away through the use of a conductor. The ATS-09B-97-C2-R0 is a type of Thermal - Heat Sink. It is designed to provide an efficient way to dissipate heat. It is typically used for a wide variety of components, such as processors, chipsets, and other lower power electrical devices.
The ATS-09B-97-C2-R0 is designed to provide an optimal level of heat dissipation. It has a rectangular shape with a finned base and four threaded holes located on the corners. The fins are made from an aluminum alloy, which is highly conductive and efficient at dissipating heat. The base of the unit is made from a copper alloy, which is also highly conductive and helps to quickly move the heat away from the component.
The ATS-09B-97-C2-R0 is also designed with a unique ventilation system that allows for the efficient outflow of heat. This system consists of two sets of grills located on the bottom and sides of the unit. These grills allow for a plentiful air supply to the unit which helps to quickly draw the heat away. In addition, the fins on the unit have been designed to increase the surface area for increased heat dissipation.
The ATS-09B-97-C2-R0 is designed to be used in a variety of applications. It is commonly used on chipsets, processors, low profile memory modules, and more. It is also suitable for use in high-end applications, such as data centers, gaming, servers, and more. In these applications, the ATS-09B-97-C2-R0 can help to reduce the total thermal resistance in order to ensure the highest level of performance.
When installing the ATS-09B-97-C2-R0, it is important to ensure that the unit is properly mounted to the system. This can be accomplished by using the four threaded mounting holes around the unit, or with the use of additional mounting brackets. The fins should also be facing outward to ensure the proper airflow, and all cables should be properly routed to ensure the best levels of cooling.
In summary, the ATS-09B-97-C2-R0 is a type of Thermal - Heat Sink that is designed to provide an efficient way to absorb and dissipate heat away from components. Its unique design helps to increase surface area for improved cooling, while the ventilation system helps to quickly draw heat away. With a wide range of applications, this unit is highly versatile and can be used in both high-end and consumer-level systems.
The specific data is subject to PDF, and the above content is for reference