| Allicdata Part #: | ATS-09C-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-09C-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09C-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management components are essential for power converter design, and ATS-09C-10-C1-R0 heat sink is one of the example of thermal management device. It is specially designed for IGBT or power MOSFET; it uses all aluminum construction to provide reliable and cost-effective solution for cooling. The heat sink features efficient thermal conduction, anodized surface finish, and a compact size. It also allows for easy and efficient mounting of the device, allowing the heat sink to be used in a wide range of applications.
The ATS-09C-10-C1-R0 heat sink offers a variety of features that make it ideal for cooling power convertors. Its all-aluminum construction helps to maximize the heat transfer rate, while the highly efficient anodized surface finish provides excellent thermal conductivity. This ensures that heat is efficiently conducted away from the IGBT or power MOSFET and into the surrounding environment. The heat sink also features a unique design that allows for easy and efficient mounting of the device, ensuring a secure fit and optimal cooling performance.
The ATS-09C-10-C1-R0 heat sink is primarily used for cooling IGBTs and power MOSFETs, although it can also be used for cooling other components such as semiconductors, ICs, and diodes. In terms of cooling performance, the ATS-09C-10-C1-R0 is one of the most efficient heat sink available. Its design ensures maximum heat transfer while its anodized surface finish helps to reduce the noise produced during operation. The heat sink has a short thermal impedance, meaning heat energy is removed from the device as quickly as possible.
The ATS-09C-10-C1-R0 heat sink also has a compact size, making it ideal for use in small spaces and tight spaces. It is designed to be as low profile as possible, allowing it to fit in areas where traditional heat sinks would be too bulky. This low profile also provides greater flexibility, allowing the heat sink to be mounted in a variety of orientations to help optimize cooling performance. Additionally, the heat sink\'s all-metal construction ensures a long service life, as it is resistant to corrosion and fatigue.
The ATS-09C-10-C1-R0 heat sink has been designed for IGBTs and power MOSFETs, but it can also be used in a variety of other applications. Its high efficiency thermal conductivity and cooling performance make it ideally suited for cooling LED drivers and other power devices. The heat sink is also an ideal choice for designs that require a compact size, as it can be easily installed in tight spaces. Additionally, the ATS-09C-10-C1-R0 is a cost-effective solution for cooling a wide range of power applications.
The specific data is subject to PDF, and the above content is for reference