| Allicdata Part #: | ATS15720-ND |
| Manufacturer Part#: |
ATS-09C-101-C2-R0 |
| Price: | $ 5.28 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X30MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09C-101-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.80060 |
| 10 +: | $ 4.67271 |
| 25 +: | $ 4.41328 |
| 50 +: | $ 4.15372 |
| 100 +: | $ 3.89416 |
| 250 +: | $ 3.63455 |
| 500 +: | $ 3.37494 |
| 1000 +: | $ 3.31003 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important design parameter for electronic systems, components, and devices. Thermal management is needed to keep devices and components within environmental temperatures within their operating ranges. In order to dissipate heat, many applications employ a variety of heat sinks or thermal sinks. The ATS-09C-101-C2-R0 heat sink is one such device used for efficient heat dissipation. This article provides an overview of the ATS-09C-101-C2-R0 application field and working principle.
The ATS-09C-101-C2-R0 heat sink is a heat transfer device designed to be used for high-heat removal applications. It is a large, single-piece aluminum extruded heat sink available with a 0.9 mm thick (or thicker) base and slotted fins. The base is composed of die-cast aluminum and the slotted fins are made from high purity aluminum, which provide maximum thermal transfer and prevent heat build up. This device is designed to mount directly to the component or device generating heat. The ATS-09C-101-C2-R0 heat sink is designed to be used in environments with ambient temperatures up to 80°C, and it can dissipate up to 35 Watts of thermal energy.
The ATS-09C-101-C2-R0 heat sink is typically used in applications requiring high thermal transfer. Common applications for the ATS-09C-101-C2-R0 include LED lighting, power supplies, telecommunications equipment, and computing applications. It can be used in rugged environments, such as outdoors or in dusty conditions, due to its die-cast aluminum base and slotted fins. The device can also be customized to fit a range of devices and components.
The ATS-09C-101-C2-R0 heat sink operates on the principle of convection heat transfer. Heat is generated by the device or component to which the heat sink is attached, and this heat is then dissipated into the surrounding environment. The device is designed to be used with a variety of thermal management solutions, including forced air cooling, liquid cooling, and mixed-mode cooling solutions. The device also has an anodized finish which helps protect it from corrosion and wear.
In summary, the ATS-09C-101-C2-R0 heat sink is a single-piece aluminum extruded heat sink designed to be used for high-heat removal applications. It can be customized to fit various devices and components and is designed to be used in rugged environments. It operates on the principle of convection heat transfer and can be used with a variety of thermal management solutions. The device is anodized which helps protect it from corrosion and wear.
The specific data is subject to PDF, and the above content is for reference