| Allicdata Part #: | ATS-09C-116-C3-R0-ND |
| Manufacturer Part#: |
ATS-09C-116-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09C-116-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a critical part of many electronics applications, and the ATS-09C-116-C3-R0 is a heat sink that helps keep the electronics running at optimal performance. This heat sink is designed for electrical and thermal protection of sensitive and delicate electronic components, and it can be used in applications from communications and computing to consumer electronics and medical equipment.
The ATS-09C-116-C3-R0 is designed to dissipate heat efficiently by providing a direct contact for the device being cooled. It features an aluminum base with a grooved surface that adds enhanced thermal conductivity and heat dispersion from the heat source. It also has a copper heat spreader and a thermally conductive aluminum oxide coating for optimal cooling performance.
To provide maximum heat dissipation, the ATS-09C-116-C3-R0 is designed with a series of heat-dissipating fins on the top and bottom of the base. This increases surface area, which increases the rate of heat conduction from the heat source. The fins also direct the heat away from the device being cooled to keep temperatures down.
The ATS-09C-116-C3-R0 also features a unique cooling system consisting of a fan and a heat spreader. The fan forces air movement across the heat spreader, which helps evenly dissipate the heat generated by the device. The heat spreader also serves to reduce the temperature at the device by absorbing and transferring the heat away from the device.
The ATS-09C-116-C3-R0 heat sink is designed for use in application fields such as telecommunications, military, aerospace, imaging, medical, printing, and consumer electronics. It is tested to withstand temperatures between -55ºC and +125ºC, and has an operational life of more than 50,000 hours. The ATS-09C-116-C3-R0 is also resistant to vibration and shock, and is designed to provide both cooling and electrical isolation.
The ATS-09C-116-C3-R0 is designed to provide superior thermal management performance for small and medium-sized applications. It provides effective heat dissipation, without the use of a cooler and a fan, making it ideal for applications where noise and power consumption are a concern. Due to its reliable performance, it is suitable for use in commercial and industrial applications, as well as consumer electronics.
The ATS-09C-116-C3-R0 heat sink is easy to install and use. It is designed to fit into devices that are considered “small form factor”, as it can be adapted to most devices with a minimum of fuss. Additionally, installation is straightforward and requires no complicated steps.
The ATS-09C-116-C3-R0 is designed to be a reliable, long-lasting solution for thermal management in all types of electronic equipment. Its superior cooling properties and resistance to vibration and shock ensure that the device will perform reliably and safely for many years. With its low power consumption and noise levels, the ATS-09C-116-C3-R0 is an ideal solution for applications that require efficient cooling without sacrificing performance.
The specific data is subject to PDF, and the above content is for reference