| Allicdata Part #: | ATS-09C-12-C1-R0-ND |
| Manufacturer Part#: |
ATS-09C-12-C1-R0 |
| Price: | $ 3.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09C-12-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.16197 |
| 30 +: | $ 3.07671 |
| 50 +: | $ 2.90581 |
| 100 +: | $ 2.73489 |
| 250 +: | $ 2.56397 |
| 500 +: | $ 2.47851 |
| 1000 +: | $ 2.22211 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor to consider in any electronic system design. Heat sinks are an essential component of any thermal management system, as they help to dissipate heat away from the electronic components. The ATS-09C-12-C1-R0 is a single stage thermoelectric heat sink designed to quickly and reliably dissipate heat away from electronic components.
The ATS-09C-12-C1-R0 is a direct-contact heat sink, meaning that it is in direct contact with the heat dissipating component. This enables the heat sink to rapidly absorb heat from the component and efficiently dissipate it away from the system. The ATS-09C-12-C1-R0 features a lightweight aluminum construction with multiple fins. These fins help to increase the surface area of the heat sink, allowing for increased heat dissipation. Additionally, the ATS-09C-12-C1-R0 includes a thermal interface material (TIM) designed to provide maximum thermal conductivity between the heat sink and the electronic component.
The ATS-09C-12-C1-R0 is suitable for use in various applications, including telecommunication and computing systems, medical electronics, LED lighting, and industrial applications. It is especially well-suited for applications with high ambient temperatures, such as those found in off-shore and medical equipment, due to its excellent thermal performance. The ATS-09C-12-C1-R0 is also easily customized, allowing for rapid prototyping and accurate model matching.
The ATS-09C-12-C1-R0 provides reliable thermal management for a wide range of applications. Its direct-contact design ensures that heat is efficiently dissipated away from sensitive equipment, reducing the risk of component failure due to overheating. Additionally, its lightweight construction and multiple fins provide maximum heat dissipation, making it an ideal solution for applications with high ambient temperatures. The ATS-09C-12-C1-R0 is also easily customized, providing users with the flexibility to rapidly prototype their designs and accurately match the specified model.
The specific data is subject to PDF, and the above content is for reference