| Allicdata Part #: | ATS-09C-122-C1-R0-ND |
| Manufacturer Part#: |
ATS-09C-122-C1-R0 |
| Price: | $ 3.28 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09C-122-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.98368 |
| 30 +: | $ 2.90325 |
| 50 +: | $ 2.74201 |
| 100 +: | $ 2.58067 |
| 250 +: | $ 2.41940 |
| 500 +: | $ 2.33875 |
| 1000 +: | $ 2.09680 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.85°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management has become increasingly important in today’s modern electronic devices, such as LED lighting, mobile phones, laptops, and other devices that generate heat. Heat sinks are a common way to dissipate heat from these devices, and the ATS-09C-122-C1-R0 heat sink is a popular choice due to its efficient cooling and long service life. In this article, we’ll look at the application field and working principle of ATS-09C-122-C1-R0 heat sinks.
The ATS-09C-122-C1-R0 heat sink is suitable for a wide range of applications, including LED lighting, power systems, and industrial control systems. It is also well suited for high-power density components that require low heat generation. This heat sink is highly efficient, providing effective thermal management in a variety of environments.
In terms of construction, ATS-09C-122-C1-R0 heat sinks are composed of a solid copper base with a nickel-plated surface. This construction increases durability and ensures a long service life. The heat sink also features a high surface area, which helps to dissipate heat quickly and efficiently. In addition, the heat sink comes with necessary mounting hardware and instructions to make installation and use easy.
The main principle of the ATS-09C-122-C1-R0 heat sink is the transfer of heat from its source to the environment. This is achieved through a combination of convection and radiation. In the convection process, heated air passes over the heat sink fins and is dispersed into the atmosphere. In the radiation process, heat is transferred from the heat sink to the environment through infrared radiation.
In terms of performance, the ATS-09C-122-C1-R0 is capable of cooling up to 200W of power. It also boasts superior heat dissipation and a large, effective cooling surface area. In addition, it can be mounted in any orientation, making it ideal for use in a range of applications.
Overall, the ATS-09C-122-C1-R0 heat sink is an effective thermal management solution for a variety of electronic devices. Its efficiency, durability, and flexibility make it a popular choice for cooling high-power density components. With its combination of convection and radiation, it provides quick and efficient heat transfer from its source to the environment.
The specific data is subject to PDF, and the above content is for reference