| Allicdata Part #: | ATS-09C-126-C1-R0-ND |
| Manufacturer Part#: |
ATS-09C-126-C1-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09C-126-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a concept that is gaining traction in the electronics industry, particularly in applications where components are exposed to higher temperatures. The ATS-09C-126-C1-R0 Heat Sink is a prime example of an economical and efficient solution for this expanding field. This article will provide a brief overview of the ATS-09C-126-C1-R0 application field and its working principle.
The ATS-09C-126-C1-R0 heat sink is a slotted aluminum, flat, low-cost thermal dissipation component. It is designed to be a simple, cost-effective solution for electronics that are exposed to any elevated levels of temperature. The ATS-09C-126-C1-R0 works by transferring a large amount of heat away from the component or module and into the atmosphere by using one or more aluminum cooling fins. This thermal energy can be used by the device to cool itself, which in turn will extend its useful life.
The ATS-09C-126-C1-R0 heat sink can be used in a range of electronic products, including cell phones, laptops and tablets, surveillance cameras, wearables, and home automation products. It is particularly suitable for compact products, as its low profile design does not significantly increase the device\'s overall size. The ATS-09C-126-C1-R0 is also suitable for high-power applications, such as automotive, medical, and high-power LED lighting, due to its ability to dissipate an impressive amount of heat with minimal effort.
The ATS-09C-126-C1-R0 heat sink works in two phases. First, a metal sheet, such as aluminum, is extruded through a series of slots, creating fins, which are then bonded to the metal sheet. The fins then act as a large surface area for air to circulate around. This air then flows over the metal bars, drawing in heat from the component or module. This heat is then dissipated into the atmosphere. Additionally, the thin metal construction helps to reduce the weight of the component and increase its heat transfer efficiency.
The ATS-09C-126-C1-R0 heat sink is a simple, yet highly effective way to help manage the temperature of electronics. It is economical, lightweight, and can be used in a variety of applications. With its efficient heat dissipation and high-performance properties, the ATS-09C-126-C1-R0 ensures that components remain cool even in the most challenging environments.
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