ATS-09C-133-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-09C-133-C1-R0-ND

Manufacturer Part#:

ATS-09C-133-C1-R0

Price: $ 5.17
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 70X70X10MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-09C-133-C1-R0 datasheetATS-09C-133-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.65003
30 +: $ 4.39152
50 +: $ 4.13318
100 +: $ 3.87488
250 +: $ 3.61655
500 +: $ 3.35823
1000 +: $ 3.29365
Stock 1000Can Ship Immediately
$ 5.17
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.756" (70.00mm)
Width: 2.756" (70.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.41°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-09C-133-C1-R0 is a type of thermal - heat sink, used to dissipate heat from various dissipative applications, such as air conditioners, refrigerators, and other systems that operate with heat. The ATS-09C-133-C1-R0, is an advanced design with its heat dissipation capabilities ranging from 18 to 60 watts. It is suitable for a range of applications, from consumer electronics to industrial-grade machinery.

In most applications, the thermal-heat sink dissipates heat away by introducing fins that extend outward from the sink\'s surface. These fins create a large air-flow area and effectively increase the surface area of the thermal-heat sink, allowing more heat to be dissipated from the units. The size and density of the fins can be adjusted to suit the specific application and design.

The ATS-09C-133-C1-R0 utilizes a unique and highly efficient design for reducing heat production while providing maximum thermal dissipation. It is composed of aluminum and copper heatsinks, which are used for efficient heat transfer and heat dissipation. The aluminum fins are connected to the copper base for increased surface area and improved transfer of heat. The copper-based portion of the heatsink provides precision cooling, and can also be designed for optimal air circulation.

The actual placement of the ATS-09C-133-C1-R0 in an application depends upon the environment. Generally, it should be placed where air flows, typically near areas that generate the most heat. Because it produces no noise and requires no maintenance, the ATS-09C-133-C1-R0 is a popular choice for computers, power supplies, and any other electronic devices that require cooling.

The working principle of the ATS-09C-133-C1-R0 is simple and effective. Heat is transferred away from the device and dissipated into the environment. This is accomplished by the copper-based portion, which acts as the transfer medium. The aluminum fins increase the surface area and allow more heat to be dissipated, while providing additional protection from the environment.

The ATS-09C-133-C1-R0 is an excellent option for any application requiring thermal-heat dissipation. It can be used in a variety of applications, be it for cooling consumer electronics or industrial-grade machinery. With its unique design and efficient working principle, the ATS-09C-133-C1-R0 can help prevent overheating in any type of system.

The specific data is subject to PDF, and the above content is for reference

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