| Allicdata Part #: | ATS-09C-137-C3-R0-ND |
| Manufacturer Part#: |
ATS-09C-137-C3-R0 |
| Price: | $ 3.20 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09C-137-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.91249 |
| 30 +: | $ 2.83395 |
| 50 +: | $ 2.67649 |
| 100 +: | $ 2.51899 |
| 250 +: | $ 2.36157 |
| 500 +: | $ 2.28284 |
| 1000 +: | $ 2.04668 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.63°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices used to absorb thermal energy and release it at a slower rate than the source. Heat sinks are commonly used in electronics, computers and other devices in order to prevent them from overheating. The ATS-09C-137-C3-R0 is a type of heat sink, or thermal radiator, designed to provide efficient cooling for high-power electronics.
The ATS-09C-137-C3-R0 is an aluminum-based thermal radiator with a number of features designed for optimal performance. It has a sliding base that allows for better heat dissipation and an adjustable height that allows the user to adjust the contact between the radiator and cooler surface. The radiator also features a unique and patented grille design for improved airflow and a textured exterior for improved thermal performance. It is also designed to allow easy access to components that need to be replaced.
When using the ATS-09C-137-C3-R0, it\'s important to connect it to a source of electricity. This will provide the power necessary to transfer heat away from the device and keep it at a safe temperature. The radiator should then be securely mounted to the device in order to ensure optimal cooling.
The primary application of the ATS-09C-137-C3-R0 is to dissipate heat from high-powered electronics, such as CPUs, GPUs, and memory. The radiator is also suitable for cooling power electronics in high-temperature environments, as well as any device that produces a large amount of heat. It can be used to cool CPU-based motherboards, graphics cards, and high-end gaming systems. By providing efficient cooling, the ATS-09C-137-C3-R0 can help to maximize the performance of the electronic components and prevent them from being damaged by excessive heat.
The ATS-09C-137-C3-R0 utilizes a combination of thermal radiation, convection, and conduction to transfer heat away from the device and into the air. Thermal radiation refers to the process of emitting radiation from a hot surface. This radiation is absorbed by cooler air molecules and then released as heat to the atmosphere. Convection is the process of circulating cool air over the surface of the radiator, which then absorbs the heat. This heated air then rises and is replaced by more cool air, resulting in an ongoing cycle of heat transfer. The last element, conduction, refers to the direct transfer of heat from a higher temperature object to a lower temperature object.
Overall, the ATS-09C-137-C3-R0 is an effective and efficient heat sink designed to provide cooling for high-powered electronics. By using a combination of thermal radiation, convection, and conduction, it can help to prevent overheating and maximize the performance of the device. This makes the ATS-09C-137-C3-R0 an ideal choice for cooling any type of electronic device.
The specific data is subject to PDF, and the above content is for reference