ATS-09C-150-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.82°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

ATS-09C-150-C2-R0 application field and working principle

Heat sinks are an essential component of many electronic devices, used to dissipate heat generated by the device. They come in a variety of shapes, sizes, and designs, but the most popular type of heat sink is the ATS-09C-150-C2-R0. This article will discuss the application field of this heat sink and its working principle.The ATS-09C-150-C2-R0 is a small heat sink designed for use with embedded and other small-scale electronic devices. It has a low-profile design, meaning that it takes up less space on a circuit board than other heat sinks. It is also designed to dissipate heat quickly and efficiently, making it ideal for use with small-scale devices that operate at high temperatures.The ATS-09C-150-C2-R0 uses a combination of a heat sink body and fans to dissipate heat. The heat sink body is composed of aluminum or other thermal-conductive material, and is designed to draw heat away from the device and into the surrounding environment. The fans are designed to draw air into the heat sink, which then circulates through the fins of the heat sink and dissipates the heat into the surrounding air. In addition, the fins of the heat sink are designed to act as a heatsink shield, meaning that they will reduce the effect of any external heat sources on the device.The ATS-09C-150-C2-R0 is most commonly used with embedded applications that produce a lot of heat, such as power supplies, telecommunications equipment, and automotive electronics. The low-profile design and efficient heat dissipation make it ideal for tight spaces. It is also often used in consumer products, such as laptop computers, because it is low-cost, efficient, and easy to install.The ATS-09C-150-C2-R0 also offers several performance advantages over other heat sink designs. It has a low thermal resistance, which means that it can dissipate heat quickly and efficiently. In addition, it is capable of dissipating heat at lower temperatures than other heat sinks, which makes it ideal for applications where temperature control is essential. Finally, it is designed to prevent excessive vibration, which can lead to premature heat sink failure.In the end, the ATS-09C-150-C2-R0 is a high-performance heat sink that is ideal for use with embedded and other small-scale devices. It offers a low-profile design and efficient heat dissipation, making it perfect for tight spaces. It is capable of dissipating heat quickly and efficiently, and can handle heat at lower temperatures than other heat sinks. Finally, it is designed to reduce vibration, which helps to prolong the life of the heat sink.

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