| Allicdata Part #: | ATS-09C-165-C1-R0-ND |
| Manufacturer Part#: |
ATS-09C-165-C1-R0 |
| Price: | $ 3.01 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09C-165-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.71026 |
| 30 +: | $ 2.63718 |
| 50 +: | $ 2.49077 |
| 100 +: | $ 2.34423 |
| 250 +: | $ 2.19769 |
| 500 +: | $ 2.12444 |
| 1000 +: | $ 1.90466 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are essential components for many electronic applications, and the ATS-09C-165-C1-R0 is one of the most popular on the market. This device is used to dissipate the heat generated by electronics, and is designed to fit into a variety of applications, including industrial, military, avionics, medical, consumer, and automotive. It is a reliable, cost-effective solution for thermal management.
The ATS-09C-165-C1-R0 is a single-stage heat sink designed to provide efficient cooling performance in applications operating at temperatures up to 165°C. It is made of aluminum with a black-anodized finish. The fins are arranged in a lattice pattern to provide optimal airflow around the device and increase its surface area, allowing it to dissipate more heat faster than other designs. The ATS-09C-165-C1-R0 also features a unique design that involves separate solderless connections for better power distribution and temperature control.
The ATS-09C-165-C1-R0 is designed to be used in a variety of applications and can be adapted to fit into more specific thermal management needs. For example, it can be used in military avionics applications, enabling more efficient cooling for high-power electronics. It can also be used in medical and consumer electronics, where major heat dissipation is necessary. In addition, the ATS-09C-165-C1-R0 can be used in automotive applications, allowing for a more reliable and cost-effective solution to cooling engine components.
The ATS-09C-165-C1-R0 is designed to provide efficient cooling performance by using natural convection. The air flow around the device is driven by natural differences in pressure, and the fin arrangements increase the surface area exposed to the air. This increases the speed of cooling, reducing the amount of time it takes to cool down a device.
In addition to cooling, the ATS-09C-165-C1-R0 also helps protect components from mechanical damage. Since it is made of aluminum, it provides a barrier against dust, dirt, and other contaminants that could damage electronics. The finish also helps to prevent corrosion, allowing the device to last longer and protecting components from long-term wear and tear.
The ATS-09C-165-C1-R0 is an efficient, reliable, and cost-effective thermal management solution for a variety of applications. The device is designed to fit into any application, enabling improved cooling performance and protecting components from mechanical damage. The unique design ensures that this device will provide an optimal solution for any thermal management need.
The specific data is subject to PDF, and the above content is for reference