| Allicdata Part #: | ATS15790-ND |
| Manufacturer Part#: |
ATS-09C-165-C2-R0 |
| Price: | $ 3.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09C-165-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.01770 |
| 10 +: | $ 2.93643 |
| 25 +: | $ 2.85692 |
| 50 +: | $ 2.69829 |
| 100 +: | $ 2.53953 |
| 250 +: | $ 2.38085 |
| 500 +: | $ 2.30148 |
| 1000 +: | $ 2.06339 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.36°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-09C-165-C2-R0 thermal heat sink is a highly efficient heat transfer device used to dissipate excess heat. It is often used to cool electronics and other sensitive components that can easily be damaged by excessive heat. The ATS-09C-165-C2-R0 is also highly resistant to corrosion, making it ideal for use in harsh environments.
The main purpose of a thermal heat sink is to draw away the heat generated by electronic components and dissipate it into the surrounding environment in order to maintain a cool operating temperature. Heat sinks transfer heat away from the component to a medium such as air or liquid. This is done by conduction, convection, and radiating the heat away from the component. Heat sinks are also used to reduce the peak temperature of the component in order to extend its lifetime.
The ATS-09C-165-C2-R0 thermal heat sink is composed of a metal base and a fin array. The base serves as a solid base for mounting the heat sink and conducts and dissipates the heat away from the component. The fin array is composed of multiple thin metal fins which increase the surface area for heat transfer. As air passes over the fins, the heat is transferred from the fin to the air via convection.
In addition to increasing the surface area for heat transfer, the fin array also increases the air flow around the component, increasing the rate of convection. This further improves the thermal efficiency of the heat sink. The ATS-09C-165-C2-R0 is highly efficient in transferring heat away from the component, making it ideal for use in high temperature and harsh environment applications.
The ATS-09C-165-C2-R0 heat sink is a great choice for cooling components in a range of applications such as computers, telecommunications, medical instruments, consumer electronics, and many more. It is easy to install and requires no additional hardware or complicated wiring. In addition, its corrosion resistant materials make it perfect for use in difficult and extreme environments.
Overall, the ATS-09C-165-C2-R0 thermal heat sink is an excellent choice for effectively dissipating heat away from components and cooling them effectively. Its high efficiency, easy installation, and corrosion resistance make it a great choice for a variety of applications in harsh and extreme environments.
The specific data is subject to PDF, and the above content is for reference