| Allicdata Part #: | ATS-09C-17-C1-R0-ND |
| Manufacturer Part#: |
ATS-09C-17-C1-R0 |
| Price: | $ 3.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09C-17-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.31695 |
| 30 +: | $ 3.22707 |
| 50 +: | $ 3.04781 |
| 100 +: | $ 2.86858 |
| 250 +: | $ 2.68930 |
| 500 +: | $ 2.59965 |
| 1000 +: | $ 2.33071 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are an important part of many electronic systems due to their ability to control temperatures and increase reliability. Heat sinks are particularly critical in applications where space is constrained, such as with laptop computers and smart phones. The ATS-09C-17-C1-R0 heat sink is a reliable and highly efficient heat sink solution, designed for a variety of applications.
With an overall size of only 73.5mm x 30.4mm, the ATS-09C-17-C1-R0 packs a lot of cooling capacity and performance into a small space. The heat sink is equipped with a large area finned base, designed to promote efficient heat transfer from the system components to the air. The ATS heat sink uses natural convection to reduce components\' temperatures, providing the passive cooling required for a wide range of applications.
The ATS-09C-17-C1-R0 features a single-point thermal conductivity of 0.4 W/mK. This value enables heat transfer of up to 50 W and up to 17°C in a specified region. The base material also helps with the thermal management, helping to further reduce component temperatures. Additionally, the fin design helps tostructures to ensure an optimal airflow and cooling.
The heat sink is designed to be mounted securely to the application and has a 1-hole corner attaching system. This system allows the heat sink to be mounted firmly in place, dramatically reducing the installation time and eliminating potential sources of thermal instability. Furthermore, the heat sink is compatible with most standard mounting plates, ensuring compatibility with a wide range of applications.
The ATS-09C-17-C1-R0 is a reliable and highly efficient heat sink solution for all types of applications. It features a small size, high thermal conductivity, and secure mounting system, making it an ideal choice for applications where space is constrained. The heat sink is designed to control temperatures, maintain device integrity, and provide exceptional cooling performance.
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