| Allicdata Part #: | ATS-09C-185-C3-R0-ND |
| Manufacturer Part#: |
ATS-09C-185-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09C-185-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat Sinks are components that dissipate heat generated by a device. The ATS-09C-185-C3-R0 is a type of heat sink that utilizes the flow of air to efficiently cool the heat generated by commercial and industrial electronic components to prevent them from premature failure. This article will discuss the application field and working principle of the ATS-09C-185-C3-R0.
The Application Field of the ATS-09C-185-C3-R0
The ATS-09C-185-C3-R0 heat sink is designed to be used in most telecom, consumer electronics, and other commercial applications. It is capable of providing a high thermal performance that is both reliable and consistent. This makes it suitable for the cooling of a variety of components such as CPUs, GPUs, LEDs, and some power ICs. It is also suitable for a wide temperature range which makes it ideal for applications in hot or cold dusty, humid, and wet environments.
The Working Principle of the ATS-09C-185-C3-R0
The ATS-09C-185-C3-R0 uses natural air convection to dissipate the heat generated by the electric components. The heat is transferred from the component to the heat sink through a thermal interface material (TIM). The heated air rises, drawing cooler air in from the side of the heat sink and creating the convection effect. This process ensures that the component is kept within its optimal temperature range and that the heat generated is continuously dispersed. The heat sink also includes a fan that can be used to further enhance the cooling performance. The fan is designed to be plugged into the same mount as the heat sink, making installation simple.
Conclusion
The ATS-09C-185-C3-R0 is a heat sink that utilizes natural air convection to dissipate heat generated by commercial and industrial electronic components. It is suitable for the cooling of a variety of components such as CPUs, GPUs, LEDs, and some power ICs. It is also suitable for a wide temperature range which makes it ideal for applications in hot or cold dusty, humid, and wet environments. The ATS-09C-185-C3-R0 also includes a fan that can be used to further enhance the cooling performance.
The specific data is subject to PDF, and the above content is for reference