| Allicdata Part #: | ATS-09C-25-C1-R0-ND |
| Manufacturer Part#: |
ATS-09C-25-C1-R0 |
| Price: | $ 4.81 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09C-25-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.32621 |
| 30 +: | $ 4.08555 |
| 50 +: | $ 3.84527 |
| 100 +: | $ 3.60499 |
| 250 +: | $ 3.36466 |
| 500 +: | $ 3.12432 |
| 1000 +: | $ 3.06424 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.25°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is vital to many electronic applications, whether it\'s a single component or a complex system. Heat sinks are the components used to dissipate excess heat produced by the device or system, either actively or passively. The ATS-09C-25-C1-R0 heat sink is an example of an active thermal management component, capable of dissipating excess heat generated by CPUs, LEDs, and other components in various applications, as well as long-term reliability of the electronics.
The ATS-09C-25-C1-R0 heat sink is a low-profile, aluminum finned heat sink designed for small electronics. It uses a copper-alloy base for improved thermal and mechanical performance. Its low profile design allows it to easily fit into tight spaces and it is also suitable for high-temperature applications. The heat sink is capable of dissipating up to 12 W of waste heat.
The ATS-09C-25-C1-R0 is available in two different sizes – 1.25” and 2” – making it suitable for a number of applications, from LED lighting to microprocessors. The heat sink is designed to be installed horizontally, making it easier to mount where space is tight. It is also designed for easy assembly and is provided with all the necessary mounting hardware.
The ATS-09C-25-C1-R0 heat sink features a dual-fin design. The fins are made of aluminum for maximum heat dissipation, and the base is copper alloy for high thermal conductivity. The heat sink also features an integrated fan mount, so a fan can be added for increased cooling. The fins are spaced close together for maximum surface area. This design is ideal for applications where space is tight and the environment is not thermally conductive.
The ATS-09C-25-C1-R0 heat sink is designed to be used in a wide range of applications. It is suitable for cooling CPUs, LEDs, other sensitive components, and even power amplifiers. The fan mount and dual-fin design also make it suitable for cooling high-power applications, such as radios and power amplifiers. In addition, the low-profile design allows it to easily fit into tight spaces, making it perfect for use in small and compact electronics.
The ATS-09C-25-C1-R0 heat sink is designed for maximum performance and reliability. It utilizes a copper alloy base, aluminum fins, and high-quality manufacturing to ensure long-term performance and reliability in all applications. It is also designed with an integrated fan mounting for increased cooling when needed. This makes the ATS-09C-25-C1-R0 heat sink suitable for a wide range of applications, including those that require thermal management in tight spaces.
The specific data is subject to PDF, and the above content is for reference