| Allicdata Part #: | ATS-09C-46-C3-R0-ND |
| Manufacturer Part#: |
ATS-09C-46-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09C-46-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks technology is used to increase the efficiency of electronic components. The ATS-09C-46-C3-R0 in particular, is a commonly used type of heat sink used for cooling and protecting sensitive electronic components, such as processor cores, memory chips and transistors. This type of heat sink operates by transferring heat away from the source and out of the enclosure.
The ATS-09C-46-C3-R0 is available in both standard and custom shapes and sizes, allowing it to be used in a variety of applications. It features a lightweight, non-conductive aluminum fin design. This design enables efficient heat transfer even at high temperature levels. The fins are connected to the baseplate of the heat sink and have a shallow surface-to-surface contact with the components being cooled. This contact prevents the heat from passing through, protecting the components from damage. The aluminum fins also act as radiators, aiding in heat dissipation.
The ATS-09C-46-C3-R0 is designed for high-end cooling requirements, making it ideal for industrial equipment, such as servers and telecommunications equipment. It is also used in medical, aeronautical, and defense applications. The low airflow requirements make it suitable for tight spaces, such as aircraft cabins or medical instrument enclosures.
The ATS-09C-46-C3-R0 features an efficient working principle which is based on the principles of convection and radiation. This involves the transfer of heat from the component by means of air convection, and through radiation, which is radiated away from the source. The convection process involves the movement of air, and the dissipation of the heat away by the fins of the heat sink. The radiation process involves the absorption and release of the heat energy, as the fins are warmed by the components.
The ATS-09C-46-C3-R0 is designed to be highly efficient in its cooling requirements. It features a low profile design, and an extruded aluminum baseplate which distributes the heat evenly across the heat sink, allowing it to effectively dissipate heat. Its low profile design ensures that it fits into tight spaces. The fin design ensures that air passes through the fins quickly and efficiently, allowing for fast heat dissipation.
The ATS-09C-46-C3-R0 is a versatile and reliable product, which can be used in a variety of applications. It offers highly efficient cooling and protection for electronic components, making it an ideal choice for industrial and medical applications. Additionally, its lightweight and low profile design makes it suitable for a variety of applications. Its low airflow requirements also make it an ideal choice for tight spaces.
The specific data is subject to PDF, and the above content is for reference