| Allicdata Part #: | ATS-09C-57-C1-R0-ND |
| Manufacturer Part#: |
ATS-09C-57-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09C-57-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The thermal-heat sinks have become an essential part of modern day electronics and are becoming more and more popular as they offer a variety of advantages such as efficient cooling, increased power capacity, and improved device durability. The ATS-09C-57-C1-R0 is an excellent example of a thermal-heat sink that has been designed for applications where high performance is required. The design incorporates an efficient fin design which is both stable and reliable. This ensures the maximum thermal dissipation is achieved.
The ATS-09C-57-C1-R0 is a single-layer, folded fin thermal-heat sink. This type of design increases the surface area of the air gap, which in turn maximizes the heat dissipation. The fins are constructed out of aluminum and feature a thin layer of copper coating for increased conductivity. This ensures a high level of heat is quickly and efficiently transferred away from the device and into the atmosphere. The fins are also laser-etched, allowing the device to accommodate a range of fin heights and air gaps.
The ATS-09C-57-C1-R0\'s working principle is fairly straightforward. As the processor in the device begins to generate heat, the thermal-heat sink draws the heat away from the processor using its efficient fin design. The copper coating on the fins enhances the thermal conductivity of the sink and helps to transfer the heat away from the device quickly and efficiently. As the heat accumulates in the surrounding air, the heat is dissipated out into the atmosphere, allowing the processor and other components to stay cool and operate at optimal temperatures.
The ATS-09C-57-C1-R0 is ideal for applications that require high levels of performance. It is commonly used in industrial, military, aviation, and medical applications as it offers a robust and reliable heating solution. The design of the thermal-heat sink also makes it suitable for applications in which the environment has frequent temperature swings. Since the device is made of aluminum, it is resistant to oxidation and other forms of corrosion, further increasing its longevity.
The ATS-09C-57-C1-R0 is a versatile and reliable thermal-heat sink that can be used in a wide range of applications. Its efficient fin design ensures maximum thermal dissipation, while the robust construction ensures longevity. The thin copper coating helps to boost thermal conductivity, allowing the device to quickly transfer heat away from the processor and other components. With its impressive performance and excellent level of reliability, the ATS-09C-57-C1-R0 is an ideal choice for any application in which high performance is required.
The specific data is subject to PDF, and the above content is for reference