| Allicdata Part #: | ATS15870-ND |
| Manufacturer Part#: |
ATS-09C-63-C2-R0 |
| Price: | $ 4.39 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09C-63-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.99420 |
| 10 +: | $ 3.88647 |
| 25 +: | $ 3.67063 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.32°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important part of any electronic device. Proper thermal management ensures that components operate efficiently while dissipating heat, protecting them from damage from overheating. As technology advances, more and more devices rely on sophisticated cooling solutions to keep them running at optimal performance levels for extended periods of time. The ATS-09C-63-C2-R0 is a thermal-heat sink designed to meet these needs.
The ATS-09C-63-C2-R0 is used in a variety of applications where reliable temperature control is required, ranging from handheld devices to larger servers. It utilizes a high thermal conductivity material which quickly dissipates heat away from components and shields them from excessive temperatures. The heat sink has an optimized fin structure which increases contact area between the heat source and the heat sink, allowing for better heat transfer and more efficient cooling.
In addition, the ATS-09C-63-C2-R0 features a thermal conductive adhesive layer which improves heat dissipation and creates an additional layer of insulation between the heat source and the heat sink. This adhesive layer also reduces the risk of thermal damage to components by providing additional protection from heat. The combination of high-performance materials and adhesive layer helps to ensure that components remain cool and function optimally even under stress.
The ATS-09C-63-C2-R0 is designed with flexibility in mind, allowing for easy installation and adjustment. The thermal-heat sink comes with an adjustable mounting mechanism that allows for precise positioning of the assembly onto the component. The adjustable design also allows for more efficient heat dissipation in cases where the heat source is located in different locations on the device. This makes the ATS-09C-63-C2-R0 a reliable and effective cooling solution for many applications.
The ATS-09C-63-C2-R0 is a reliable and efficient thermal-heat sink solution that can be used in many different applications where steady temperatures are a must. By utilizing a combination of high-performance materials and an adhesive layer, it efficiently dissipates heat from components and improves their performance. In addition, its adjustable design makes installation and adjustment easier for a variety of device configurations. Together, these features make the ATS-09C-63-C2-R0 a reliable and effective cooling solution for many applications.
The specific data is subject to PDF, and the above content is for reference