| Allicdata Part #: | ATS-09C-72-C1-R0-ND |
| Manufacturer Part#: |
ATS-09C-72-C1-R0 |
| Price: | $ 4.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-09C-72-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.99042 |
| 30 +: | $ 3.76887 |
| 50 +: | $ 3.54715 |
| 100 +: | $ 3.32545 |
| 250 +: | $ 3.10376 |
| 500 +: | $ 2.88206 |
| 1000 +: | $ 2.82664 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.09°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components in modern electronics. They are designed to dissipate internal heat generated by electronics during operation. Heat, if not removed, can cause serious damage to electronic components leading to premature failure, poor performance, or even catastrophic failure. The ATS-09C-72-C1-R0 from Alpha Thermal Solutions is a high performance thermal heat sink that can provide optimal thermal management for a wide range of applications.
The ATS-09C-72-C1-R0 heat sink is made from aluminum with a black oxide coating for added protection against corrosion. The heat sink features a heat spreader design with seventy-two individual pin-fins for maximum heat dissipation. The pin-fins unify into two continuous surfaces which arch to maximize surface area and rendering a more efficient dissipation of heat. The heat spreader design also make the heat sink compatible with a number of components including Intel and AMD processors and graphics cards.
The ATS-09C-72-C1-R0 is extremely lightweight, making it suitable for applications where weight is a concern. The heat sink is also available with either a high or low profile base, depending on the application. The low profile base is ideal for applications such as fan-cooled components, while the high profile version supports larger surface area and better heat dissipation for heavy-duty components which run at higher temperatures.
The application field of the ATS-09C-72-C1-R0 covers a wide range of applications. This heat sink provides thermal management for components found in computers, laptops, server racks, gaming consoles, and more. It is designed to provide efficient cooling to components ranging from CPUs, GPUs, and MOSFETs to FPGAs and HVACs. In addition, the ATS-09C-72-C1-R0 can also be used to improve the life and performance of laptop batteries.
The ATS-09C-72-C1-R0 is designed with a thermoelectric working principle in mind. This principle relies on a heat pump to move heat from one area to another. The movement of heat is achieved by using a temperature gradient. As heat is generated by the component, the heat sink absorbs it and dissipates it away from the component. This reduces the temperature of the component and increases its life span and performance.
The ATS-09C-72-C1-R0 is the perfect solution for providing efficient and reliable thermal management. It offers a lightweight, highly efficient design with superior heat dissipation capabilities and is compatible with a range of components. Its thermoelectric working principle ensures optimal thermal management and extended life span for components. For these reasons, it is an ideal choice for a variety of thermal management applications.
The specific data is subject to PDF, and the above content is for reference